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A kind of epoxy resin toughening curing agent and preparation method and application thereof

A technology of epoxy resin and curing agent, applied in the direction of epoxy resin glue, epoxy resin coating, adhesive, etc., can solve the problem of inability to achieve toughening and improving effect, and achieve the improvement of toughening and improving effect, comprehensive functions, and preparation. simple method effect

Active Publication Date: 2022-08-05
上海稳优实业有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the embodiments of the present invention is to provide an epoxy resin toughening and curing agent to solve the problem that the existing epoxy resin curing agent proposed in the above background technology cannot achieve a good toughening and improving effect

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  • A kind of epoxy resin toughening curing agent and preparation method and application thereof

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preparation example Construction

[0017] As another preferred embodiment of the present invention, the preparation method of the modified diphenylmethane-4,4'-diisocyanate comprises: weighing the diphenylmethane-4,4'-diisocyanate and heating it to 45-65 ℃, then vacuumize and add triglyceride and polypropylene glycol to mix, then add acrylate and 2-ethyl-1,3-hexanediol and heat to 45-65 ℃ for insulation, vacuum to remove moisture to obtain the Described modified diphenylmethane-4,4'-diisocyanate.

[0018] As another preferred embodiment of the present invention, in the method for preparing modified diphenylmethane-4,4'-diisocyanate, the vacuuming is performed by using a negative pressure pump until the vacuum degree is 0.6- 60Pa, because it is heated and reacted under negative pressure vacuum conditions to make modified diphenylmethane-4,4'-diisocyanate, while ensuring the normal progress of the reaction, it effectively reduces the reaction temperature caused by excessively high reaction. Moreover, due to the ...

Embodiment 1

[0038]An epoxy resin toughening curing agent, comprising the following raw materials: 80 kilograms of modified diphenylmethane-4,4'-diisocyanate, polyoxypropylene triol (molecular weight is 400, and the hydroxyl group of polyoxypropylene triol is 80 kg). The value is 80 mgKOH / g) 7 kg, polycaprolactone polyol 20 kg, isobutylene-maleic anhydride copolymer 1 kg, imidazole compound 20 kg, and an appropriate amount of organic solvent. Wherein, the amount of the organic solvent used is 60 wt % of the weight of the modified diphenylmethane-4,4'-diisocyanate. The imidazole compound is dimethylimidazole. The organic solvent is N,N-dimethylformamide.

[0039] In this embodiment, the preparation method of the epoxy resin toughening curing agent specifically includes the following steps:

[0040] 1) According to the mass ratio of diphenylmethane-4,4'-diisocyanate, triglyceride, polypropylene glycol, acrylate and 2-ethyl-1,3-hexanediol is 12:20:18:1: Diphenylmethane-4,4'-diisocyanate wa...

Embodiment 2

[0044] An epoxy resin toughening curing agent, comprising the following raw materials: 120 kilograms of modified diphenylmethane-4,4'-diisocyanate, polyoxypropylene triol (molecular weight is 1200, and the hydroxyl group of polyoxypropylene triol is 1200 kg). The value is 120 mgKOH / g) 15 kg, polycaprolactone polyol 40 kg, isobutylene-maleic anhydride copolymer 6 kg, imidazole compound 50 kg, and an appropriate amount of organic solvent. Wherein, the amount of the organic solvent is 130 wt % of the weight of the modified diphenylmethane-4,4'-diisocyanate. The imidazole compound is dimethylimidazole. The organic solvent is N,N-dimethylformamide.

[0045] In this embodiment, the preparation method of the epoxy resin toughening curing agent specifically includes the following steps:

[0046] 1) According to the mass ratio of diphenylmethane-4,4'-diisocyanate, triglyceride, polypropylene glycol, acrylate and 2-ethyl-1,3-hexanediol is 18:40:40:8: Weigh diphenylmethane-4,4'-diisoc...

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Abstract

The invention relates to the technical field of curing agent production, and specifically discloses an epoxy resin toughening curing agent and a preparation method and application thereof. The epoxy resin toughening curing agent comprises the following raw materials: modified diphenylmethane-4 , 4'-diisocyanate, polyoxypropylene triol, polycaprolactone polyol, isobutylene-maleic anhydride copolymer, imidazole compound and an appropriate amount of organic solvent. By using modified diphenylmethane-4,4'-diisocyanate, polyoxypropylene triol, polycaprolactone polyol and the like as raw materials, the epoxy resin toughening curing agent prepared by the invention can effectively improve the resistance to epoxy resin. Compared with the traditional single-component curing agent, the toughening and improving effect of the resin has more comprehensive functions, which solves the problem that the existing epoxy resin curing agent cannot achieve a good toughening and improving effect. Moreover, the preparation method provided by the embodiment of the present invention is simple and has broad market prospects.

Description

technical field [0001] The invention relates to the technical field of curing agent production, in particular to an epoxy resin toughening curing agent and a preparation method and application thereof. Background technique [0002] With the continuous development of science and technology, people's performance requirements for bonding materials are also constantly improving. Among them, adhesives, potting glue and other products are common bonding materials used for bonding, which can realize rapid bonding between various materials. application. Most common bonding materials are based on resin curing to achieve bonding effect. One of the necessary raw materials is a curing agent. Through the curing agent, chemical reactions such as condensation, ring closure, addition or catalysis are generated to make thermosetting properties. The resin cures to achieve the bonding and fixing between the materials. [0003] At present, most of the curing agents used in epoxy resin adhesi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G59/40C08G18/62C08G18/48C08G18/42C09D163/00C09J163/00
CPCC08G59/4057C08G18/6204C08G18/4829C08G18/4277C08G18/4063C08G18/4018C09D163/00C09J163/00
Inventor 刘祥飞吕言言
Owner 上海稳优实业有限公司
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