Evaporation structure, radiator, semiconductor device and preparation method

Abstract

The embodiment of the invention provides an evaporation structure, a radiator, a semiconductor device and a preparation method. The preparation method of the evaporation structure comprises the steps that: a substrate is provided, a bottom plate, a side plate connected with the bottom plate, and a plurality of backflow pieces arranged on the bottom plate at intervals are formed on the substrate, a liquid filling opening is formed in the side plate, the side plate surrounds the bottom plate, so that a cavity with an opening is formed in the substrate; capillary structure layers are formed on the inner surface of the bottom plate, the inner surface of the side plate and the surfaces of the backflow pieces; a base top is provided, a protection piece is arranged in a welding area of the base top, and a capillary structure layer is formed on the side, provided with the protection piece, of the base top to form a top plate; the protection piece is separated from the top plate, so that a welding area can be exposed; the welding area of the top plate corresponds to the side plate and the backflow pieces, the top plate, the side plate and the backflow pieces are welded and fixed through the welding area, and the opening is sealed so that the bottom plate, the top plate and the side plate can be matched to form an evaporation cavity; evaporating liquid is injected through the liquid filling opening, and the liquid filling opening is sealed to form an evaporation structure.

Description

technical field [0001] The invention relates to the technical field of evaporation structure preparation, in particular to an evaporation structure, a radiator, a semiconductor device and a preparation method. Background technique [0002] At present, the chip is the core of electronic equipment for computing, and it is also one of the main heating elements of electronic equipment. In traditional chips, semiconductor components such as wafers are packaged in a metal case, and the metal case is used to conduct away the heat generated by the semiconductor components, thereby realizing heat dissipation of the chip. [0003] That is to say, at present, the wafer inside the chip is fixed on the substrate through solder balls. When the wafer is working, the heat generated by the wafer is dissipated to the substrate below through the solder balls, and at the same time, the heat is dissipated to the metal shell on the top through the heat-conducting material above the wafer. physic...

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Problems solved by technology

[0004] However, the heat dissipation method of the traditional chip only conducts heat through the metal shell, and the heat dissipation effect is not good. Therefore, how to provide an evaporation structure that can effectively conduct heat and dissipate heat for semiconductor devices such as chips is a hot topic being studied by those skilled in the art. topic

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