Frameless ultrathin front lead-out TVS chip packaging structure

Abstract

The invention provides a frameless ultrathin front lead-out TVS chip packaging structure, which comprises a chip, a pair of lead wires, a conductive adhesive layer, a pair of frames and a packaging body, wherein the chip is of a transverse structure, lead-out electrodes of the chip are positioned on the front surface of the chip, the pair of lead wires are respectively bonded on the lead-out electrodes of the chip, the inner end of the conductive adhesive layer is bonded at the tail end of a copper wire, each frame is bonded with the outer end of the conductive adhesive layer, the packaging body wraps the chip, the lead wires, the conductive adhesive layer and the frames, and the tail ends of the frames are exposed out of the packaging body; the lead wires adopt copper wires and are bonded on the extraction electrode of the chip through thermo-acoustic welding; the conductive adhesive layer is formed by conductive silver adhesive; and the packaging body is formed by epoxy resin molding compound. The chip packaged by using the packaging structure is not of a longitudinal structure, but a transverse structure, and electrical connection is performed on the front surface of the wafer, so that the packaging structure has the effects of simplifying the process flow, improving the production effect and reducing the cost, and meanwhile, the performance of the chip can be exerted to the greatest extent.

Description

technical field [0001] The invention relates to a transient voltage suppressor, in particular to a frameless ultra-thin front-leading TVS chip packaging structure. Background technique [0002] Packaging is to connect the circuit pins on the silicon chip to the external joints with wires so as to connect with other devices. It not only plays the role of installing, fixing, sealing, protecting the chip and enhancing the electrothermal performance, but also through The contacts of the chip are connected to the pins of the package shell with wires, and these pins are connected to other devices through the wires on the printed circuit board, so as to realize the connection between the internal chip and the external circuit. At present, the chips of transient voltage suppressor (TVS) products are packaged vertically up and down, and the front and back of the chip need to be electrically connected at the same time. The packaging process is relatively complicated. For example, thin...

AI Technical Summary

Problems solved by technology

At present, the chips of transient voltage suppressor (TVS) products are packaged vertically up and down, and the front and back of the chip need to be electrically connected at the same time. The packaging process is relatively complicated. For example, thinning the back metal is a process that is difficult to control. , It is easy to cause fragments and back gold to fall off. Professional wire bonding equipment is required for wire bonding. Since the wire bonding requires very high precision, the equipment is very expensive and the overall efficiency is not high, which makes the production efficiency low and the cost high.

Images