Microphone flexible circuit board and manufacturing method thereof

Abstract

The invention discloses a microphone flexible circuit board and a manufacturing method thereof. The microphone flexible circuit board comprises a base layer (5), a first copper layer (4), a bonding pad layer (3) and a microphone (2); a through hole group is formed in the base layer (5), and the through hole group comprises a plurality of through holes (50); the first copper layer (4) is arranged on the surface of one side of the base layer (5) and is provided with a first avoiding hole (40) for avoiding the through hole group; the bonding pad layer (3) comprises a solder mask (31) and an annular bonding pad (30) which are arranged on the first copper layer (4), and a center hole (300) of the annular bonding pad (30) is corresponding to the first avoiding hole (40); and the microphone (2) is connected to the annular pad (30). According to the microphone flexible circuit board and the manufacturing method thereof, the plurality of dense through holes are formed to form sound transmission holes, so that foreign matters can be effectively prevented from passing through the through holes, and the acoustic performance and the use performance of a microphone are ensured.

Description

technical field [0001] The present application relates to the technical field of flexible circuit boards, in particular to a microphone flexible circuit board and a manufacturing method thereof. Background technique [0002] Microphone (microphone), the scientific name is a microphone, also known as a microphone, a microphone. It is an energy conversion device that converts sound signals into electrical signals. According to the principle, it is classified into moving coil, capacitive, electret and silicon micro microphones, as well as liquid microphones and laser microphones. [0003] At present, most electronic products on the market, such as smart phones and computers, use relatively advanced silicon microphones (MEMS Microphone) for the microphones inside. In electronics, microphones are usually soldered to a flex circuit board. Such as figure 1 and figure 2 as shown, figure 1 A cross-sectional structure diagram of a flexible circuit board in the prior art is shown...

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Problems solved by technology

[0004] The flexible circuit board with the above-mentioned structure has the following disadvantages: First, the diameter of the sound hole on the flexible circuit board usually reaches 1mm. performance; secondly, the sound transmission hole on the base layer 13 is made by a punching process, and the burrs produced by punching will affect the welding of the flexible circuit board and the microphone element, and will also have an impact on the performance of the subsequent microphone, and the sound transmission hole 17 and the The avoidance hole 120 has the requirement of concentricity. The accuracy of the punching hole of the ordinary mold is about 2mil. At the same time, the cumulative expansion and contraction of the flexible board will cause punching offset, resulting in smaller and irregular sound transmission holes, resulting in defective products. , is not conducive to improving the yield

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