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Resin sealing device

A technology of resin sealing device and mounting part, which is applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problem of large deviation of substrate thickness and size, and achieve the effect of accurate clamping

Pending Publication Date: 2021-06-18
ASAHI ENG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since the FCBGA substrate has a multilayer structure, it is thicker than conventional BGA (Ball Grid Array: ball grid array) products, and because of the multilayer structure, the thickness of the substrate varies greatly.

Method used

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  • Resin sealing device
  • Resin sealing device
  • Resin sealing device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0038] figure 1 It is a longitudinal sectional view showing a schematic structure of a lower mold portion of a resin sealing device according to an embodiment of the present invention, figure 2 yes means figure 1 The picture of the state where the lower die is removed, image 3 yes figure 1 top view of Figure 4 It is an explanatory diagram showing the arrangement of thickness measuring means.

[0039] Such as figure 1 and figure 2 As shown, the resin sealing device according to the embodiment of the present invention has a mold base 2 on a molded part 1 . The mold base 2 detachably supports the lower mold 3 . The lower mold 3 is used to clamp a plurality of substrates 6 between the lower mold 3 and the upper mold 5 (refer to Figure 6 ), and to the mold cavity 51 formed between the lower mold 3 and the upper mold 5 (refer to image 3 ) to inject resin for resin sealing molding.

[0040] in addition, image 3 In the figure, the position of the mold cavity 51 f...

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PUM

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Abstract

The invention provides a resin sealing device, which can clamp a plurality of independent substrates such as FCBGA on a mold to perform resin seal molding, and can accurately clamp the substrates to uniformly perform resin seal molding under the condition that the thicknesses of the substrates are deviated. The resin sealing device is provided with: a lower mold (3) having: a plurality of substrate mounting parts (31) on which a plurality of substrates are separately mounted; and a rod (32) which penetrates through the lower die in the vertical direction and abuts against each of the plurality of substrate mounting parts (31); a thickness measuring means for measuring the thickness of each of the plurality of substrates; a mold base 2 for detachably supporting the lower mold 3; an adjusting mechanism 23 which presses a rod 32 by a pressing member 22 penetrating a mold base 2 according to a thickness of each of the plurality of substrates measured by the thickness measuring means, and individually adjusts heights of a plurality of substrate mounting parts (31).

Description

technical field [0001] The present invention relates to a resin sealing device for resin-sealing an independent substrate such as an FCBGA (Flip Chip Ball Grid Array). Background technique [0002] In resin sealing molding of semiconductors, there is an increasing demand for resin sealing molding of individual substrates such as FCBGA (one substrate corresponds to one product (the number of chips ranges from one to multiple)). Since this FCBGA substrate has a multilayer structure, it is thicker than conventional BGA (Ball Grid Array: ball grid array) products, and because of the multilayer structure, the dimensional variation in substrate thickness is large. Furthermore, since the chip mounted on the substrate is large and generates a lot of heat, there is also a desire to mold the surface of the chip in an exposed state and mount a heat sink in a later process. [0003] For example, Patent Document 1 discloses a resin molding die which has a first die and a second die, and...

Claims

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Application Information

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IPC IPC(8): B29C45/14B29C45/26B29C45/37H01L21/56
CPCB29C45/14639B29C45/26B29C45/376H01L21/565B29C2045/2683
Inventor 石井正明
Owner ASAHI ENG CO LTD