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A kind of heat conduction phase change material and its application

A thermally conductive filler and phase change technology, applied in heat exchange materials, coatings, chemical instruments and methods, etc., and can solve the problem of rare thermal conductivity phase change materials

Active Publication Date: 2022-03-29
JIANGXI BLUESTAR XINGHUO SILICONE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, thermally conductive phase change materials that can be coated by screen printing technology are rare in the market

Method used

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  • A kind of heat conduction phase change material and its application
  • A kind of heat conduction phase change material and its application
  • A kind of heat conduction phase change material and its application

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0084] 1. Preparation of basic polymer:

[0085] Step 1): Add 1 mole of allyl polyoxyethylene ether into a four-necked flask, heat up to 90°C, fill with nitrogen, stir mechanically, and add catalyst A with a total amount of 10ppm in the four-necked flask after constant temperature; use The number of chain members of the allyl polyoxyethylene ether determines the n in the reaction product 1 , and the two values ​​are equal, the corresponding relationship is shown in Table 1 below;

[0086] Step 2): Put 1 mole of hydrogen-containing silicone oil into a four-necked flask through a peristaltic pump, and the addition rate is 1ml / min; the number of hydrogen-containing silicone oil chains used determines the n 2 , and the two values ​​are equal, the corresponding relationship is shown in Table 1 below;

[0087] Step 3): The reaction was completed at 90° C. for 5 h. And distilled under reduced pressure at 95°C for 4h to obtain polyether silicone oil. The infrared spectrum of the p...

Embodiment 1

[0097] The components of the thermally conductive phase change material of this embodiment include by weight parts:

[0098] 20 parts of base polymer A,

[0099] Median particle size D treated with hexamethyldisilazane 50 40 parts of zinc oxide of 0.5 μm,

[0100] Median particle size D treated with hexamethyldisilazane 50 40 parts of 5 μm alumina.

[0101] The above materials were put into a high-speed stirring tank, heated to 60°C, stirred at a speed of 500r / m for 30min under a negative pressure of -0.085MPa, and discharged in a molten state to obtain the thermally conductive phase change material of Example 1.

Embodiment 2

[0103] The components of the thermally conductive phase change material of this embodiment include by weight parts:

[0104] 15 parts of base polymer B,

[0105] Median particle size D treated with KH550 50 65 parts of zinc oxide of 1 μm,

[0106] Median particle size D treated with KH550 50 20 parts of 20 μm boron nitride.

[0107] The above materials were put into a high-speed stirring tank, heated to 70°C, stirred at a speed of 400r / m for 20min under a negative pressure of -0.085MPa, and discharged in a molten state to obtain the thermally conductive phase change material of Example 2.

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Abstract

The present invention relates to a thermally conductive phase change composition, which comprises polyfunctionally modified polysiloxane as a base polymer and thermally conductive fillers, wherein the polyfunctionally modified polysiloxane is obtained by polyether functional groups and has Antioxidant functional group modified polysiloxane. The invention also relates to thermally conductive phase change products obtained from said composition.

Description

technical field [0001] The invention belongs to the field of polymer materials, and in particular relates to thermally conductive phase-change materials and applications thereof. Background technique [0002] With the development of science and technology, the integration of electronic components is getting higher and higher, and the calorific value per unit volume is getting larger and larger. The problem of heat dissipation has long become the bottleneck of design. Failure to solve the heat dissipation problem will directly shorten the life of electronic equipment, and even affect its normal use. In order to solve the heat dissipation problem of heating electronic components, heat sinks are usually designed. However, the surface of the electronic components and the heat sink cannot be absolutely flat, and more than 90% of the air gap exists on the contact surface, which greatly increases the thermal resistance. [0003] In order to reduce the interface thermal resistance...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09D183/12C09D7/62C09K5/06C09K5/14
CPCC09D183/12C09D7/62C09K5/063C09K5/14C08K2003/2296C08K2003/2227C08K2003/385C08K2003/2213C08K2003/085C08L2201/08C08K9/06C08K3/22C08K3/38C08K3/08C08K2201/001C08G77/46C08K3/04C08L83/12C08L83/06C09K5/06
Inventor 谭奎吕玉霞何丹丹吴超波
Owner JIANGXI BLUESTAR XINGHUO SILICONE CO LTD
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