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Infrared single-photon detector vacuum packaging structure integrating refrigeration function and optical fiber

A single-photon detector, vacuum packaging technology, applied in the field of single-photon detection, can solve the problem of no refrigeration and optical fiber integration in the same package

Inactive Publication Date: 2021-06-25
传周半导体科技(上海)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there is a problem with the above inventions: the refrigeration and the optical fiber are not integrated in the same package at the same time, so that they can only be used separately in the package structure of cooling package or integrated optical fiber

Method used

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  • Infrared single-photon detector vacuum packaging structure integrating refrigeration function and optical fiber
  • Infrared single-photon detector vacuum packaging structure integrating refrigeration function and optical fiber

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Embodiment Construction

[0019] The present invention will be further described below in conjunction with specific examples.

[0020] figure 2 An embodiment of the vacuum packaging structure of an infrared single photon detector integrated with refrigeration and optical fiber is given. It is composed of an infrared single-photon avalanche photodiode (1), a semiconductor cooling chip (2), a tube shell (3), pins (4), a heat dissipation bottom shell (5), an adjustable focal length lens (6), an optical fiber (7 ), an optical fiber adapter (8), a packaging cavity (9) and an optical fiber connector (10). In the designed packaging structure, the tube casing (3) and the heat dissipation bottom casing (5) are closely connected together, and after the two are sealed, a vacuum environment is formed in the packaging cavity (9) through vacuum treatment; the infrared single-photon avalanche photodiode (1) Attached to the cold end of the semiconductor refrigeration sheet (2), the semiconductor refrigeration sheet...

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Abstract

The invention provides an infrared single-photon detector vacuum packaging structure integrating a refrigeration function and an optical fiber. The infrared single-photon detector vacuum packaging structure is composed of an infrared single-photon avalanche photodiode (1), a semiconductor refrigeration sheet (2), a tube shell (3), a tube pin (4), a heat dissipation bottom shell (5), an adjustable focal length lens (6), the optical fiber (7), an optical fiber adapter (8), a packaging cavity (9) and an optical fiber connector (10). According to the invention, the refrigeration function, an optical fiber coupling function and a vacuum condition required by an infrared single-photon avalanche optical fiber diode are integrated in one structure, so the integration degree of packaging of the infrared single-photon avalanche optical fiber diode is greatly improved, and the infrared single-photon avalanche optical fiber diode can be widely applied to the fields of optical fiber communication, quantum communication, photoelectric measurement and the like.

Description

[0001] (1) Technical field [0002] The invention relates to an infrared single photon detector vacuum packaging structure integrating refrigeration and optical fiber, which can be used in optical fiber communication, quantum communication and photoelectric measurement. The invention belongs to the technical field of single photon detection. [0003] (2) Background technology [0004] Single-photon detection technology is one of many technologies for ultra-sensitive optical signal detection, and it has a very wide range of applications in physics, chemistry, biology and other disciplines as well as engineering applications. Among the single-photon detection technologies in many bands, the near-infrared single-photon detection technology has attracted more attention due to its wide application and importance, especially in the quantum security communication system with important application value, the near-infrared single-photon detection technology in the communication band As...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L31/0203H01L31/024H01L31/0232G02B6/42
CPCG02B6/4204H01L31/0203H01L31/02325H01L31/024
Inventor 张义荣邓仕杰
Owner 传周半导体科技(上海)有限公司