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Surface elastic wave filter, duplexer and module

An elastic wave filter and elastic wave technology, applied in the direction of electrical components, impedance networks, etc., can solve the problems that are difficult to suppress noise and affect the damping characteristics of devices, and achieve less noise, high Q value, and high electromechanical coupling coefficient The effect of the Q value

Pending Publication Date: 2021-06-25
SANAN JAPAN TECH CORP +1
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

This high frequency noise can adversely affect the damping characteristics of the device
As a result, passband systems used in mobile communication equipment are adversely affected, or signals transmitted from said passband systems are likely to adversely affect systems in other frequency bands
However, it is difficult to suppress such noise only by adjusting the layer thickness of the piezoelectric layer constituting the elastic wave filter.

Method used

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  • Surface elastic wave filter, duplexer and module
  • Surface elastic wave filter, duplexer and module
  • Surface elastic wave filter, duplexer and module

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Embodiment Construction

[0051] Figure 1 to Figure 3 A sectional view (shown on the right side) and a schematic diagram (shown on the left side) of a resonator constituting the surface acoustic wave filter of the present invention are respectively shown. Each resonator 1A, 1B, 1C is provided with a base substrate 2, a piezoelectric layer 4 with a different thickness, an IDT electrode 5 (Interdigital Transducer, IDT) formed on the piezoelectric layer 4 and an An intermediate layer 3 between the base substrate 2 and the piezoelectric layer 4 . The main vibration in each harmonic oscillator 1A, 1B, 1C is the horizontal shear mode (SH mode).

[0052] The base substrate 2 is made of a high-resistance semiconductor or insulator, such as polycrystalline or monocrystalline silicon or sapphire. The material used for the base substrate 2 is not limited to the above-mentioned materials, and can also be polycrystalline silicon, polycrystalline Al 2 o 3 , polycrystalline sapphire, etc., or any other material ...

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Abstract

A surface elastic wave filter comprises a harmonic oscillator, the harmonic oscillator comprises a substrate, a piezoelectric layer and an IDT electrode, the piezoelectric layer is formed on the substrate and made of piezoelectric materials, the IDT electrode is formed on the piezoelectric layer, the substrate is composed of a high-impedance semiconductor or an insulator, and the dielectric layer is formed on the substrate. The wavelength [lambda] of the elastic wave is determined according to the electrode period of the IDT electrode, the elastic wave can be divided into a plurality of regions having different thicknesses, the IDT electrodes are respectively positioned on the plurality of regions to constitute the resonators, and the resonators formed in the plurality of regions are connected to each other to constitute a resonator. According to the surface elastic wave filter, the duplexer comprising the surface elastic wave filter and the module comprising the surface elastic wave filter, high-frequency noise can be restrained, and meanwhile a high Q value is kept.

Description

technical field [0001] The present invention relates to a surface elastic wave filter, a duplexer and a module including the surface elastic wave filter. Background technique [0002] In communication device terminals such as mobile phone terminals and portable information terminals, elastic wave devices used in antenna filters or duplexers require higher Q values. Among elastic wave devices, bulk elastic wave filters and surface elastic wave filters are included. Among the aforementioned elastic wave devices, although the use of surface acoustic wave filters is the mainstream, surface acoustic wave filters have a problem of lower Q values ​​than bulk elastic wave filters. [0003] In order to improve the Q value, as described in Patent Document 1 (Japanese Patent Application Laid-Open No. 2002-534886), by using a substrate made of silicon or sapphire, a substrate made of lithium tantalate or lithium niobate is bonded as thin as possible. The multilayer film structure of t...

Claims

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Application Information

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IPC IPC(8): H03H9/145H03H9/25H03H9/64
CPCH03H9/145H03H9/25H03H9/64
Inventor 中村浩渡边纪之垣尾省司
Owner SANAN JAPAN TECH CORP
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