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Chip structure, chip assembly, film forming method, nanopore sequencing device and application

A chip structure and chip technology, applied in biochemical cleaning devices, biochemical equipment and methods, enzymology/microbiology devices, etc., can solve problems such as uneven film thickness of thin films

Active Publication Date: 2021-07-02
QITAN TECH LTD CHENGDU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] This application provides a chip structure, a chip component, a film forming method, a nanopore sequencing device and its application, aiming to solve the problem that the film thickness of each structural unit of the current chip structure is not uniform

Method used

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  • Chip structure, chip assembly, film forming method, nanopore sequencing device and application
  • Chip structure, chip assembly, film forming method, nanopore sequencing device and application
  • Chip structure, chip assembly, film forming method, nanopore sequencing device and application

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Embodiment 1

[0131] A film-forming method of an amphiphilic molecular layer comprises the following steps:

[0132] supply Figure 7 The chip assembly formed by the film of the amphiphilic material, wherein the chip structure is as follows figure 2 shown. The chip structure includes a first functional film layer structure 200 , a second functional film layer structure 600 and an oil drain channel 300 . The first functional film layer structure 200 communicates with the second functional film layer structure 600 through the oil discharge channel 300 . The gasket 400 includes a first receiving cavity 410 and a second receiving cavity 420 . The first accommodating cavity 410 and the second accommodating cavity 420 are not connected to each other, the first accommodating cavity 410 completely surrounds the first functional film layer structure 200 , and the second accommodating cavity 420 completely surrounds the second functional film layer structure 600 .

[0133] The polar solvent, the n...

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Abstract

The invention provides a chip structure, a chip assembly, a film forming method, a nanopore sequencing device and application. The chip structure comprises a substrate layer, a first functional film layer structure and an oil storage structure. The first functional film layer structure is arranged on the surface of the substrate layer, the first functional film layer structure comprises a plurality of first structure units distributed in an array mode, and the adjacent first structure units are communicated with each other; the oil storage structure can adsorb a non-polar solvent or limit the non-polar solvent to enter, and the oil storage structure is communicated with the first functional film layer structure. The oil storage structure can adsorb the non-polar solvent or limit the non-polar solvent to enter. The non-polar solvent directionally moves from a high-content area to a low-content area, the non-polar solvent in the first functional film layer structure can directionally flow towards a second functional film layer structure, and the non-polar solvent in the first structure units with thicker films can directionally flow towards the first structure units with thinner films. Therefore, the thickness of the thin film in each first structure unit is uniform and thin.

Description

technical field [0001] The application relates to the field of amphiphilic molecular layers, in particular to a chip structure, a chip component, a film forming method, a nanopore sequencing device and applications. Background technique [0002] The chip structure in which the amphiphilic material is formed into a film includes a film-forming region, and the film-forming region has a plurality of structural units. The polar solvent, the non-polar solvent and the polar solvent of the amphiphilic material are sequentially passed through the chip structure to form a film for each structural unit. On the structural unit forming the amphiphilic material film, the non-polar solvent of the amphiphilic material is sandwiched between two layers of polar solvent to form a film. However, the current chip structure has the problem that the film thickness of each structural unit is not uniform, and the film that is too thick loses its functionality, which affects the test efficiency and...

Claims

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Application Information

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IPC IPC(8): C12M1/42C12M1/00C12Q1/6869
CPCC12Q1/6869C12Q2565/607C12Q2565/631C12Q2535/122
Inventor 朱睿任世龙严勇
Owner QITAN TECH LTD CHENGDU