Insoluble anode and pulse electroplating equipment
A soluble anode and anode technology, applied in the direction of the electrode, can solve the problems of affecting the uniformity and efficiency of copper plating, damaging the active coating on the surface of the anode, etc.
Pending Publication Date: 2021-07-13
深圳铱创科技有限公司
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Problems solved by technology
However, in the vertical pulse copper plating system, during the reverse time of pulse electroplating, when the insoluble anode reverses to become the cathode, the surface of the insoluble anode will precipitate copper and deposit on the surface, and the active coating on the surface of the anode will be damaged by frequent reverse operation for a long time , thus affecting the uniformity and efficiency of copper plating
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[0033] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention.
[0034] In the description of the present invention, multiple means more than one, and multiple means more than two. Greater than, less than, exceeding, etc. are understood as not including the original number, and above, below, within, etc. are understood as including the original number. If the description of the first and second is only for the purpose of distinguishing the technical features, it cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features...
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The invention discloses an insoluble anode and pulse electroplating equipment. The insoluble anode comprises a coating anode and a protective anode; and the surface of the coating anode is coated with an active material. The insoluble anode is suitable for a pulse electroplating process; in the electroplating process, a workpiece to be electroplated is placed on the other side, opposite to the coating anode, of the protective anode, a gap exists between the protective anode and the coating anode, at the moment, the workpiece to be electroplated is closer to the protective anode, and the projection of the coating anode on the protective anode is located inside the outer edge of the protective anode, so that the protective anode shields the coating anode. In the pole reversing process, copper ions in an electrolyte can be preferentially separated out on the protective anode close to the workpiece to be electroplated, so that the situation that copper elementary substances are separated out on the coating anode and an active material on the surface of the coating anode is damaged can be avoided, the service life of the coating anode is prolonged, and the uniformity of copper electroplating is improved.
Description
technical field [0001] The invention relates to the field of electroplating process equipment, in particular to an insoluble anode and pulse electroplating equipment. Background technique [0002] In recent years, PCB (printed circuit board) has been developed rapidly, the size of PCB is getting smaller and smaller, and the requirements for the production process of PCB are getting higher and higher. In the electroplating process of PCB, when the current density of the traditional soluble anode is high, the copper ball is prone to polarization, and the shape change of the copper ball is more likely to cause bad current distribution during the electroplating process. [0003] In related technologies, insoluble anodes are used instead of soluble anodes. The insoluble anodes will not dissolve into the electrolyte during electroplating. The materials of the insoluble anodes are usually metal materials with chemical properties such as titanium and niobium. The surface of the ins...
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IPC IPC(8): C25D17/12C25D5/18
CPCC25D17/12C25D5/18
Inventor 郑列俭贺齐群
Owner 深圳铱创科技有限公司