Wafer transfer box cleaning equipment and system

Abstract

The invention provides wafer transfer box cleaning equipment and system which can save space, are compact in action and can avoid particle adhesion. The cleaning equipment comprises a front machine table and a rear machine table. The front machine table comprises a first frame body, a first horizontal displacement mechanism, a turnover mechanism, a suction device, a first vertical displacement mechanism, a front cleaning tank, a front cleaning device and a first isolation wall device; the rear machine table comprises a second frame body, a rear cleaning tank, a rear isolation device and a rear cleaning device; the front machine table can separate the box body from the door body, so that the door body descends, and the box body is overturned to the rear machine table for respective cleaning; the cleaning system comprises cleaning, moving, nitrogen charging and temporary storage equipment; the moving equipment can drive the wafer transfer box cleaned by the cleaning equipment to move; the nitrogen charging equipment can receive the wafer transfer box brought by the movement of the moving equipment from the cleaning equipment to charge nitrogen for the wafer transfer box; the temporary storage equipment can receive the wafer transfer box transferred by the moved equipment from the nitrogen charging equipment for temporary storage and output.

Description

technical field [0001] The invention relates to a cleaning structure and system capable of processing wafer transfer boxes and putting them into use again, in particular to a wafer transfer box cleaning equipment and system. Background technique [0002] In today's semiconductor manufacturing process, it is necessary to use a variety of methods to process the wafer. The wafer will pass through a series of process equipment and need to be transported many times during the process. Therefore, when storing and transporting the wafer, you need to pay attention not to It can be damaged by external impact, and it needs to be managed so that the surface of the wafer is not contaminated by impurities such as moisture, dust, and various organic substances. [0003] Therefore, in the process, a front opening unified pod (Front Opening Unified Pod; FOUP, or front opening integrated box) will be used to transport and store multiple wafers, which is an important carrier for transport and...

AI Technical Summary

Problems solved by technology

[0005] In order to avoid contamination, the cleaning time of FOUP needs to be shortened, but traditional FOUP cleaning machines are affected by the number of cleaning cycles, high complexity, high cleanliness requirements, and shared robots, making time shortening a piece of cake. very difficult

[0006] In addition, traditional FOUP cleaning machines take up more space, require longer maintenance time, and are prone to solid particle contamination.

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