Encapsulation structure

Abstract

An encapsulation structure may include a flexible substrate, a plurality of electronic elements, a first partition wall, a second partition wall, and a gas barrier layer. The flexible substrate has a device region and a non-device region. The electronic elements are disposed in the device region of the flexible substrate. The first partition wall surrounds one or more of the electronic elements. The second partition wall surrounds the first partition wall. There is at least one trench between the first partition wall and the second partition wall. The gas barrier layer covers one or more of the electronic elements and the surface of the first partition wall. The surface of the first partition wall has a higher surface energy than the surface of the second partition wall.

Description

technical field [0001] The present invention relates to a packaging structure, in particular to a packaging structure including a gas barrier layer. Background technique [0002] With the advancement of electronic component industry technology, electronic components have developed from hard and inflexible properties to soft and flexible properties. This development process is accompanied by changes in the materials used in electronic components. For example, flexible substrates have replaced hard glass substrates in many applications, and various components in electronic components are gradually developed to be made of flexible materials, such as organic materials. When flexible electronic components are made of organic materials, the ability to block water vapor and oxygen has always been an urgent problem to be solved. In order to effectively prolong the life of flexible electronic components, various packaging structures focus on the technical means of blocking water vap...

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Problems solved by technology

[0003] If the entire surface of the gas barrier layer is used to cover all the electronic components on the flexible substrate, the flexibility of the flexible substrate will be reduced

On the other hand, if the entire surface of the gas barrier layer is too thin, the effect of water and gas barrier cannot be achieved, but if the entire surface of the gas barrier layer is too thick, the substrate will not be flexible, or the flexible substrate will be bent. The entire gas barrier layer is broken and its gas barrier effect is deteriorated

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