Embedded transparent circuit board and manufacturing method thereof

Abstract

An embedded transparent circuit board, comprising: a first circuit substrate, including a first transparent medium layer and a first conductive circuit layer formed on the first transparent medium layer; grooves are formed on the first transparent medium layer, at least one The electronic components are accommodated and fixed in the groove; the second circuit substrate includes the second transparent medium layer and the second conductive circuit layer formed on the second transparent medium layer; the surface of the first conductive circuit layer and the second conductive circuit layer and a blackening layer is formed on the side; and transparent glue, the first transparent medium layer, transparent glue and the second transparent medium layer are stacked together in sequence; the transparent glue is filled in the gap between the inner wall of the groove and the electronic component, The first conductive circuit layer or the second conductive circuit layer is electrically connected to the electronic components. The invention also provides a method for manufacturing the embedded transparent circuit board. The embedded transparent circuit board provided by the invention has better connection reliability.

Description

technical field [0001] The invention relates to a printed circuit board technology, in particular to an embedded transparent circuit board and a manufacturing method thereof. Background technique [0002] With the continuous development of electronic products in the direction of light weight, high frequency, high density and high performance, and in some specific scenarios, transparent electronic products gradually show their various advantages. In order to realize the transparency of electronic products, there is an increasing demand for transparent printed circuit boards, such as mice, earphones, antennas, etc. [0003] At present, transparent media such as polyethylene terephthalate (PET) and polyethylene naphthalate (polyethylene naphthalate two formic acid glycol ester, PEN) are widely used in the industry to form flexible copper clad laminates to make transparent flexible laminates. circuit board. PET and PEN have the problem of insufficient heat resistance, which ma...

AI Technical Summary

Problems solved by technology

Therefore, when printing solder paste to mount electronic components, PET and PEN are very easy to shrink and wrinkle, resulting in low reliability of the connection between electronic components and the flexible copper clad substrate

If non-light-transmitting materials are used, there will be a problem of low alignment accuracy, which is not conducive to component inspection

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