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Chemical mechanical grinding and polishing pad finisher and preparation method thereof

A technology of chemical machinery and polishing pads, which is applied in the direction of grinding/polishing equipment, manufacturing tools, grinding devices, etc., can solve the problems of limiting the performance of the dresser, increase the flexibility of use, reduce the cost of use, and ensure the dressing effect Effect

Inactive Publication Date: 2021-07-27
KONFOONG MATERIALS INTERNATIONAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The arrangement of diamond abrasive grains on the dresser made by these methods has been determined at the manufacturing stage, and it is impossible to arrange abrasive grains with different spacing and sizes in different areas on a dresser, which limits the performance of the dresser

Method used

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  • Chemical mechanical grinding and polishing pad finisher and preparation method thereof
  • Chemical mechanical grinding and polishing pad finisher and preparation method thereof
  • Chemical mechanical grinding and polishing pad finisher and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0033] This embodiment provides a chemical mechanical polishing polishing pad dresser, the polishing pad dresser includes a base, the base is provided with at least one groove, the inside of the groove is provided with a grinding block, and the grinding area Protruding abrasive grains are provided on the outer surface of the block, and the thickness of the block is not less than the depth of the groove.

Embodiment 2

[0035] This embodiment provides a chemical mechanical polishing pad dresser, its structure is as follows: figure 1 As shown, the polishing pad conditioner includes a circular aluminum alloy base, the base is provided with three grooves (a circular groove in the middle, two annular grooves), and the inside of the groove is provided with Grinding block, the thickness of the grinding block is 2mm, the outer surface of the grinding block is provided with conical raised abrasive grains, the material of the grinding block is aluminum oxide, and the thickness of the block is not less than the thickness of the groove depth.

Embodiment 3

[0037] This embodiment provides a chemical mechanical polishing pad dresser, its structure is as follows: figure 2 As shown, the polishing pad dresser includes a circular ceramic base, the base is provided with 6 circular grooves, the grooves are arranged at equal intervals along the circumference of the base, and the inside of the groove is provided with a grinding Block, the thickness of the grinding block is 1mm, the outer surface of the grinding block is provided with pyramid-shaped raised abrasive grains, the material of the grinding block is silicon carbide, and the thickness of the block is not less than the depth of the groove .

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Abstract

The invention provides a chemical mechanical grinding and polishing pad finisher and a preparation method thereof. The polishing pad finisher comprises a base, wherein the base is provided with at least one groove, a grinding block is arranged in the groove, raised abrasive particles are arranged on the outer surface of the grinding block, and the thickness of the block is not less than the depth of the groove. According to the finisher, through the combined design of the grinding blocks and the base, the finisher can be matched with working conditions by replacing the block, so that the use flexibility of the finisher is improved, and the use cost of the finisher is reduced. Moreover, the finisher is high in overall hardness, wear-resistant and corrosion-resistant, and the raised abrasive particles on the grinding surface can be effectively controlled through a machining process, so that the finishing effect of the finisher is ensured.

Description

technical field [0001] The invention belongs to the field of chemical mechanical grinding, and relates to a chemical mechanical grinding polishing pad dresser and a preparation method thereof. Background technique [0002] With the development of semiconductor process technology, photolithography technology has higher and higher requirements on the flatness of wafer surface. Currently, chemical mechanical polishing (CMP) is the most commonly used global planarization process. During chemical mechanical polishing, the dresser is used to remove impurities on the polishing pad (Pad), keep the surface of the polishing pad fresh, ensure the polishing quality of the polishing pad, improve the service life of the polishing pad, and greatly reduce the cost of consumables. The most widely used dressing device is the diamond dressing device, which uses diamond as the dressing abrasive grain, and is regularly or randomly fixed on the carcass of a certain material according to a certain...

Claims

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Application Information

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IPC IPC(8): B24B53/017B24D18/00
CPCB24B53/017B24D18/0072
Inventor 姚力军边逸军潘杰王学泽陈石廖培君
Owner KONFOONG MATERIALS INTERNATIONAL CO LTD
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