A w-band multi-channel hermetically sealed phased array sip module

Abstract

The invention discloses a W-band multi-channel hermetically sealed phased array SIP module, comprising: a SIP cavity, on which a plurality of W-band waveguide ports are arranged; a plurality of radio frequency links located in the SIP cavity In the body, the radio frequency link is a multi-point link, and its ports are all connected to the W-band waveguide port; the connecting sub-board is composed of a radio frequency substrate and an interface board; the AD control chip is located in the SIP cavity, and the AD The control chip is connected to the radio frequency link through the radio frequency substrate, and the AD control chip is also connected to the interface board. In the present invention, the radio frequency link is a multi-link, which reduces the number of required components and facilitates the integration of circuits into small-sized structures.

Description

technical field [0001] The invention relates to the technical field of SIP modules, in particular to a W-band multi-channel hermetically sealed phased array SIP module. Background technique [0002] As one of the four atmospheric windows with smaller transmission loss in the millimeter wave frequency band, the W frequency band has broad application prospects in the field of phased arrays due to its high frequency, wide frequency band, and low loss. SIP, or system in package, refers to a package in which two or more different chips are assembled together to form a system. [0003] The W-band frequency is higher, and the corresponding circuit structure size is small, which has very strict requirements on circuit processing, structure processing, assembly technology and other aspects. The channel spacing required by the W-band phased array is small. Usually, a single channel needs to simultaneously realize functions such as channel transceiver signal amplification, phase-shift...

AI Technical Summary

Problems solved by technology

Due to the technical reasons of each link, the TR design of the W frequency band may involve a large number of tests, debugging, repairs and replacements, and the integrated TR design will bring greater risk of failure and waste of design and production time

In order to ensure the performance of W-band signal transmission, the air waveguide transmission method is usually used. This transmission method causes the input and output parts of the SIP module to have waveguide openings, and it is difficult to achieve airtightness.

[0004] Due to the above reasons, the current W-band TR component design has a high design threshold, and the SIP small module packaging design is less used in the TR design. At the same time, it is difficult to realize the airtight design of the W-band TR channel.

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