Polishing equipment for semiconductor silicon wafer
A technology for silicon wafers and semiconductors, applied in grinding/polishing equipment, metal processing equipment, surface polishing machine tools, etc., can solve problems such as insufficient polishing, and achieve sufficient polishing effect
Active Publication Date: 2021-08-06
史穆康科技(浙江)有限公司
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Problems solved by technology
[0004] In order to solve the above-mentioned technical problems, a polishing equipment for semiconductor silicon wafers is provided. This technical solution solves the above-mentioned problem of insufficient polishing, and realizes sufficient polishing of silicon wafers.
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[0070] The following description serves to disclose the present invention to enable those skilled in the art to carry out the present invention. The preferred embodiments described below are only examples, and those skilled in the art can devise other obvious variations.
[0071] As a preferred embodiment of the present invention, the present invention discloses a polishing device for a semiconductor silicon wafer, comprising:
[0072] frame;
[0073] The silicon wafer position adjustment mechanism is installed on the frame, on which there is a total rotating turntable of the polishing station connected to the frame in rotation, and the general rotating turntable of the polishing station is provided with circularly distributed Several polishing stations are divided into rotating assemblies, and each polishing station is provided with a polishing position adjusting assembly on the rotating assembly. The polishing position adjusting assembly is connected with a polishing carryi...
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The invention relates to the technical field of silicon wafers, in particular to polishing equipment for semiconductor silicon wafers, which comprises a silicon wafer position adjusting mechanism on a rack, a polishing mechanism and a liquid dropping assembly, wherein a polishing station master rotating turntable rotatably connected with the rack is arranged on the silicon wafer position adjusting mechanism; a plurality of polishing station branch rotating assemblies which are circumferentially distributed on the polishing station master rotating turntable are arranged on the polishing station master rotating turntable, a polishing position adjusting assembly is arranged on each polishing station branch rotating assembly, and a polishing bearing assembly is in transmission connection with each polishing position adjusting assembly; the upper polishing bearing assembly is provided with a pressing assembly used for pressing the silicon wafer to be polished, and the pressing assembly is rotationally connected with the polishing bearing assembly; the polishing mechanism is installed on the rack, located beside the silicon wafer position adjusting mechanism and used for polishing the silicon wafer to be polished; the liquid dropping assembly is installed on the rack and located on the silicon wafer, and full polishing of the silicon wafer is achieved.
Description
technical field [0001] The invention relates to the technical field of silicon wafers, in particular to a polishing device for semiconductor silicon wafers. Background technique [0002] Semiconductor silicon wafers are the main substrate material for manufacturing VLSI. With the rapid development of the semiconductor industry, the precision requirements for substrate materials are getting higher and higher. Generally, the outer circumference of silicon wafers needs to be adjusted during substrate processing. The surface is polished to ensure that there are no defects on the edge of the silicon wafer during subsequent processing, reducing stress concentration, reducing the fragmentation rate, and improving the yield. The edge polishing of silicon wafers generally needs to be completed on special polishing equipment, and most of them adopt the method of mechanochemical polishing, using polishing liquid and polishing cloth, and achieving edge polishing under certain pressure a...
Claims
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IPC IPC(8): B24B7/22B24B29/02B24B27/00B24B41/00B24B41/02B24B41/06
CPCB24B7/228B24B29/02B24B27/0023B24B27/0069B24B41/007B24B41/02B24B41/068Y02P70/50
Inventor 姚亚君
Owner 史穆康科技(浙江)有限公司