Conductor lead for protection circuit and protection circuit comprising lead

A technology for protecting circuits and leads, applied in the field of conductor materials for electronic circuits, can solve problems such as product failure, product short circuit, product leakage, etc., achieve high surge capacity, low clamping voltage, and ensure the effect of not being damaged

Active Publication Date: 2021-08-13
江西萨瑞微电子技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] During the application of ordinary anti-surge diodes, if there is an abnormal current higher than the product's withstand capacity or an abnormal voltage higher than the product's starting voltage, the product will fail. The failure mode is usually the chip breakdown that causes the product to leak and the product causes a short circuit. Effect

Method used

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  • Conductor lead for protection circuit and protection circuit comprising lead
  • Conductor lead for protection circuit and protection circuit comprising lead

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] Such as figure 1 As shown, a protection circuit is connected to the protected chip (TVS chip 3) and the chip fixing bracket 5 through the conductive glue 6, and then the protected chip and the lead bracket 4 are connected through the lead wire 1, and finally the whole is packaged with epoxy resin 2 A circuit, forming a protection circuit for the protected chip; the surface of the protected chip connected to the lead 1 is coated with an aluminum layer, and the lead 1 is connected through the aluminum layer. Wherein, the diameter of the wire is 1.2 mil; the thickness of the aluminum layer is 2 μm.

[0022] The lead wire is made of copper alloy, and the ratio of the copper alloy raw material is 0.6% of zinc powder, 2.5% of nickel powder, 0.5% of zirconium powder, 0.4% of cerium powder, 0.6% of silicon powder, tin powder 0.06%, iron powder 0.3%, boron powder (powder after sieving) 0.2%, and the rest is copper powder, totaling 100%. The preparation method of the lead wire ...

Embodiment 2

[0030] Such as figure 1 As shown, a protection circuit is connected to the protected chip (TVS chip 3) and the chip fixing bracket 5 through the conductive glue 6, and then the protected chip and the lead bracket 4 are connected through the lead wire 1, and finally the whole is packaged with epoxy resin 2 A circuit, forming a protection circuit for the protected chip; the surface of the protected chip connected to the lead 1 is coated with an aluminum layer, and the lead 1 is connected through the aluminum layer. Wherein, the diameter of the wire is 1.2 mil; the thickness of the aluminum layer is 2 μm.

[0031]The lead wire is made of copper alloy, and the ratio of the copper alloy raw materials is 0.7% by weight of zinc powder, 2.8% of nickel powder, 0.6% of zirconium powder, 0.4% of cerium powder, 0.7% of silicon powder, tin powder 0.07%, iron powder 0.5%, boron powder (powder after sieving) 0.3%, the rest is copper powder, totaling 100%. The preparation method of the lead...

Embodiment 3

[0039] Such as figure 1 As shown, a protection circuit is connected to the protected chip (TVS chip 3) and the chip fixing bracket 5 through the conductive glue 6, and then the protected chip and the lead bracket 4 are connected through the lead wire 1, and finally the whole is packaged with epoxy resin 2 A circuit, forming a protection circuit for the protected chip; the surface of the protected chip connected to the lead 1 is coated with an aluminum layer, and the lead 1 is connected through the aluminum layer. Wherein, the diameter of the wire is 1.2 mil; the thickness of the aluminum layer is 2 μm.

[0040] The lead wire is made of copper alloy, and the ratio of the copper alloy raw material is 0.8% of zinc powder, 3.0% of nickel powder, 0.7% of zirconium powder, 0.5% of cerium powder, 0.7% of silicon powder, tin powder 0.07%, iron powder 0.7%, boron powder (powder after sieving) 0.3%, and the rest is copper powder, totaling 100%. The preparation method of the lead wire ...

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Abstract

The invention discloses a conductor lead for a protection circuit. The lead is made of a copper alloy, and the copper alloy comprises the following raw materials in percentage by weight of 0.6%-0.9% of zinc powder, 2.5%-3.5% of nickel powder, 0.5%-0.8% of zirconium powder, 0.4%-0.5% of cerium powder, 0.6%-0.8% of silicon powder, 0.06%-0.08% of tin powder, 0.3%-0.8% of iron powder, 0.2%-0.4% of boron powder and the balance of copper powder, totaling 100%. The protection circuit open circuit product manufactured by adopting the lead is suitable for a DFN packaging series, has very low clamping voltage, quick response and relatively high surge bearing capability, and can quickly respond to switching off to ensure that the protection circuit is not damaged under the condition that the voltage and the current are higher than the designed rated voltage and the rated current.

Description

technical field [0001] The invention belongs to the technical field of conductor materials for electronic circuits, and in particular relates to a conductor lead wire for a protection circuit and a protection circuit including the lead wire. Background technique [0002] During the application of ordinary anti-surge diodes, if there is an abnormal current higher than the product's withstand capacity or an abnormal voltage higher than the product's starting voltage, the product will fail. The failure mode is usually the chip breakdown that causes the product to leak and the product causes a short circuit. Effect. Contents of the invention [0003] Therefore, the present invention provides a conductor lead wire for a protective circuit, the lead wire is made of copper alloy, and the ratio of the copper alloy raw material is 0.6% to 0.9% of zinc powder and 2.5% to 0.9% of nickel powder in parts by weight. 3.5%, zirconium powder 0.5%~0.8%, cerium powder 0.4%~0.5%, silicon pow...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C9/06C22C1/02C22F1/08H01L23/49
CPCC22C9/06C22C1/02C22F1/08H01L24/45H01L24/43H01L2224/45147H01L2224/43H01L2224/4321H01L2224/73265H01L2224/32245H01L2224/48247H01L2924/181H01L2924/00012
Inventor 李运鹏段洪胡司云
Owner 江西萨瑞微电子技术有限公司
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