A semiconductor refrigeration device

A refrigeration device and semiconductor technology, applied in the direction of household refrigeration devices, refrigerators, refrigeration and liquefaction, etc., can solve the problems of reducing the reliability of the metal heat sink, the outer wall of the metal heat sink is easy to get wet, and the risk of increasing the risk of bacterial growth, etc., to achieve The effect of reducing the probability of bacterial growth, low maintenance and repair costs, and high reliability
CN113251690BActive Publication Date: 2022-05-20福建三能节能科技有限责任公司
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
福建三能节能科技有限责任公司
Publication Date
2022-05-20

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Abstract

The invention discloses a semiconductor refrigeration device, which belongs to the technical field of semiconductor refrigeration. The invention includes a box body and a refrigeration assembly facing the interior of the box for cooling; the refrigeration assembly has at least one semiconductor refrigeration sheet, and the semiconductor refrigeration sheet A metal heat sink is attached to the cooling end of each metal heat sink; an airflow channel is formed on the surface of each metal heat sink, and the two ends of the metal heat sink are connected through a main pipe, and a circulation pump and a dehumidification mechanism are arranged on the main pipe. The air circulation in the air flow channel and the main pipeline air-dries and sucks the condensed water on the surface of the metal radiator. The invention has the beneficial effects of being able to avoid the accumulation of condensed water on the outer wall of the metal heat sink, reducing the risk of corrosion, high reliability, beneficial to prolonging the service life of the metal heat sink, and low maintenance and repair costs.
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Description

technical field

[0001] The invention relates to the technical field of semiconductor refrigeration, in particular to a semiconductor refrigeration device. Background technique

[0002] At present, with the development of semiconductor refrigeration technology, refrigeration equipment using semiconductor refrigeration chips for refrigeration is also widely used. After the semiconductor is energized, the heat from the cold end is moved to the hot end, resulting in a decrease in the temperature of the cold end and an increase in the temperature of the hot end. Cooling effect, no refrigerant is needed in the cooling process, sustainable work, no pollution source, energy saving and environmental protection;

[0003] A Chinese invention patent disclosed in the prior art, the application date is December 03, 2014, the application number is 201410721995.0, and the announcement number is CN105650936B "A Multi-stage Semiconductor Refrigeration Component and Semiconductor Refrigeration...

Claims

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