A semiconductor refrigeration device

A refrigeration device and semiconductor technology, applied in the direction of household refrigeration devices, refrigerators, refrigeration and liquefaction, etc., can solve the problems of reducing the reliability of the metal heat sink, the outer wall of the metal heat sink is easy to get wet, and the risk of increasing the risk of bacterial growth, etc., to achieve The effect of reducing the probability of bacterial growth, low maintenance and repair costs, and high reliability

Active Publication Date: 2022-05-20
福建三能节能科技有限责任公司
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AI Technical Summary

Problems solved by technology

[0005] However, during the cooling process, the outer wall of the metal radiator is easy to get wet, which increases the risk of bacterial growth, reduces the reliability of the metal radiator, and increases the cost of subsequent maintenance and repairs.

Method used

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  • A semiconductor refrigeration device
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Embodiment Construction

[0035] In order to enable those skilled in the art to better understand the technical solutions of the present invention, the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0036] see figure 1 Shown, embodiment one;

[0037] Invent a semiconductor refrigeration device, including:

[0038] The box body 10, the cooling assembly 20 that is refrigerated towards the inner tank 11 of the box body 10;

[0039] The cooling assembly 20 has at least one semiconductor cooling chip 21, and a metal heat sink 22 is attached to the cooling end 211 of the semiconductor cooling chip 21; the surface of each metal cooling body 22 is formed with an air flow channel 23, and the two ends of the air flow channel 23 pass through the main pipe 30 Connected, the main pipeline 30 is provided with a circulation pump 31 and a dehumidification mechanism, and the condensed water on the surface of the metal radiator 22 is air-dried and sucked th...

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Abstract

The invention discloses a semiconductor refrigeration device, which belongs to the technical field of semiconductor refrigeration. The invention includes a box body and a refrigeration assembly facing the interior of the box for cooling; the refrigeration assembly has at least one semiconductor refrigeration sheet, and the semiconductor refrigeration sheet A metal heat sink is attached to the cooling end of each metal heat sink; an airflow channel is formed on the surface of each metal heat sink, and the two ends of the metal heat sink are connected through a main pipe, and a circulation pump and a dehumidification mechanism are arranged on the main pipe. The air circulation in the air flow channel and the main pipeline air-dries and sucks the condensed water on the surface of the metal radiator. The invention has the beneficial effects of being able to avoid the accumulation of condensed water on the outer wall of the metal heat sink, reducing the risk of corrosion, high reliability, beneficial to prolonging the service life of the metal heat sink, and low maintenance and repair costs.

Description

technical field [0001] The invention relates to the technical field of semiconductor refrigeration, in particular to a semiconductor refrigeration device. Background technique [0002] At present, with the development of semiconductor refrigeration technology, refrigeration equipment using semiconductor refrigeration chips for refrigeration is also widely used. After the semiconductor is energized, the heat from the cold end is moved to the hot end, resulting in a decrease in the temperature of the cold end and an increase in the temperature of the hot end. Cooling effect, no refrigerant is needed in the cooling process, sustainable work, no pollution source, energy saving and environmental protection; [0003] A Chinese invention patent disclosed in the prior art, the application date is December 03, 2014, the application number is 201410721995.0, and the announcement number is CN105650936B "A Multi-stage Semiconductor Refrigeration Component and Semiconductor Refrigeration...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F25B21/02F25D19/04
CPCF25B21/02F25D19/04
Inventor 郭建涛
Owner 福建三能节能科技有限责任公司
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