Warping-adjustable Vcsel epitaxial structure and preparation method thereof
An epitaxial structure and adjustable technology, applied to the structure of the active region, laser components, electrical components, etc., can solve the problems of epitaxial wafer bending, affecting the uniformity of the epitaxial layer, and crystal quality deterioration, so as to reduce stress, Improve the uniformity of each parameter and reduce the effect of warpage
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[0028] The present invention will be described in detail below in conjunction with specific embodiments. Obviously, the described embodiments are only a part of the embodiments of the application, not all of them. All other embodiments obtained under the premise of creative work all belong to the scope of protection of this application. In addition, it should be noted that the process parameters that are not specifically limited in the present invention all adopt the conventional process parameters of the VCSEL chip.
[0029] like figure 1 As shown, an adjustable warpage Vcsel epitaxial structure of the present invention includes a substrate 101, which is a GaAs substrate, on which a buffer layer 102, N-type doped DBR103, Active layer 104 , oxidation confinement layer 105 , P-type doped DBR 106 and ohmic contact layer 107 .
[0030] Among them, the N-type doped DBR 103 includes 25-35 pairs of Al 0.1 GaAs / Al 0.9 GaAs DBR layer, the optical thickness of each layer is λ / 4, an...
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