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Double-axis diffraction type silicon optical acceleration sensor and preparation method thereof

An acceleration sensor and silicon photonics technology, applied in the field of photon sensors, can solve the problems of centroid shift and complex structure of two mass blocks, and achieve the effect of compact structure, avoiding difficult alignment, and convenient mass production

Pending Publication Date: 2021-08-27
OTN INTELLIGENT TECH (SUZHOU) CO LTD
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  • Application Information

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Problems solved by technology

[0004] KazemZandi et al. disclose a sensor in the paper "Design and Demonstration of an In-Plane Silicon-on-Insulator Optical MEMS Fabry–Pérot-Based Accelerometer Integrated With Channel Waveguides", such as figure 1 As shown, it needs to use two mass blocks on the left and right, resulting in a complex structure, and the two mass blocks are prone to center-of-mass shift due to machining errors during processing

Method used

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  • Double-axis diffraction type silicon optical acceleration sensor and preparation method thereof
  • Double-axis diffraction type silicon optical acceleration sensor and preparation method thereof
  • Double-axis diffraction type silicon optical acceleration sensor and preparation method thereof

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Embodiment 1

[0053] This embodiment provides a kind of biaxial diffraction type silicon optical acceleration sensor, such as figure 2 shown, including:

[0054] The base silicon-based material 1 has a cavity in the middle;

[0055] A fixed anchor 2 is located on the top of the base silicon-based material 1;

[0056] Two groups of waveguide blocks 4 are respectively connected with two optical fibers 9, and serve as paths for the optical fibers 9 to emit or receive light;

[0057] Two mass blocks 3 are located in the cavity, and the four corners are connected to the fixed anchor 2 through the elastic connection structure 7, and the vibration sensitive directions of the two mass blocks 3 are perpendicular to each other and are introduced into and connected with the two groups of waveguide blocks 4 respectively. The direction of the light rays drawn out is parallel;

[0058] Two sets of Bragg reflector arrays 5 are arranged on the substrate silicon-based material 1, and a row of protrusion...

Embodiment 2

[0068] The preparation process of the diffractive silicon optical acceleration sensor of the present embodiment, such as Figure 4 shown, including the following steps:

[0069] S1: Take an SOI wafer, the SOI wafer includes a base layer 12, a top layer 11 and an oxide layer 13 between the base layer 12 and the top layer 11;

[0070] S2: Coating photoresist 14 on the surface of the top layer 11, etching to form two mass blocks 3, all elastic connection structures 7 and fixed anchors 2 of corresponding structures, and etching to form a Bragg reflector 6 on the mass block 3 at the same time, Etching the waveguide block 4 and the Bragg mirror array 5 on the top layer 11;

[0071] S4: Coating photoresist on the bottom surface of the base layer 12 for etching, removing the base layer 12 corresponding to the mass block 3 and the elastic connection structure 7, and retaining the part connected to the fixed anchor 2;

[0072] S5: Release the oxide layer 13 to connect the upper cavity...

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Abstract

The invention relates to a diffraction type silicon optical acceleration sensor. Two groups of Bragg reflector arrays and Bragg reflectors which are perpendicular to each other are molded on a substrate silicon-based material, can be processed and molded at one time through an MEMS manufacturing process, and is convenient for batch manufacturing. Acceleration measurement in two directions can be simultaneously carried out through the optical fibers emitted by the two optical fibers which are perpendicular to each other, the structure is compact, and meanwhile the problem that two single-axis accelerations are difficult to align through packaging integration is solved.

Description

technical field [0001] The application belongs to the technical field of photon sensors, and in particular relates to a biaxial diffraction type silicon optical acceleration sensor and a preparation method thereof. Background technique [0002] At present, micro-electromechanical (MEMS) accelerometers are usually capacitive, but capacitive accelerometers have the disadvantages of low sensitivity, high power consumption, high temperature dependence and high cross-sensitivity, and are not immune to electromagnetic interference, so they are not suitable as Aerospace applications such as satellites. [0003] Optical MEMS sensors are often used in industrial processes, aerospace and military applications. Optical MEMS sensors are highly immune to electromagnetic interference and can adapt to high temperature and other hazardous environment applications. [0004] KazemZandi et al. disclose a sensor in the paper "Design and Demonstration of an In-Plane Silicon-on-Insulator Optical...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01P15/03
CPCG01P15/03
Inventor 刘晓海俞童
Owner OTN INTELLIGENT TECH (SUZHOU) CO LTD
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