Roll-to-roll copper foil micro-etching method
A roll-to-roll, copper foil technology, applied in electrical components, printed circuit manufacturing, transportation and packaging, etc., can solve the problem that graphite particles are easily adsorbed on copper foil, and achieve the effect of ensuring the binding force
Active Publication Date: 2021-08-27
XIAMEN UNIV OF TECH
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[0004] The present invention provides a roll-to-roll copper foil micro-etching method, which aims to improve the problem that graphite particles are easily adsorbed on copper foil in the prior art by adopting a roll-to-roll micro-etching process
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[0033] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments It is some embodiments of the present invention, but not all of them. Based on the implementation manners in the present invention, all other implementation manners obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention. Accordingly, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the invention. Based on the implementation manners in the present invention, all other implement...
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The invention provides a roll-to-roll copper foil micro-etching method, and relates to the technical field of circuit board production. The roll-to-roll copper foil micro-etching method comprises the following steps: after cleaning, performing hole conditioning, black shadow and fixing, a circuit board passes through two micro-etching grooves, and ultrasonic vibration in the micro-etching process, so that stripped graphite particles are prevented from being attached to a copper foil again; then washing, blowing and drying the circuit board, and detecting the binding force of the circuit board and the dry film; and finally, performing acid pickling, electroplating and anti-oxidation treatment. Therefore, the micro-etching efficiency of the copper foil can be improved by utilizing a roll-to-roll production mode, the graphite particles can be prevented from being attached to the copper foil, and the binding force of the copper foil and the dry film meets the requirement.
Description
technical field [0001] The invention relates to the technical field of circuit board production, in particular to a roll-to-roll copper foil microetching method. Background technique [0002] Flexible printed circuit board (FPC) is a highly reliable and excellent flexible printed circuit board made of polyimide or polyester film as the base material. In traditional technology, flexible circuit boards are produced in sheet form, which not only has high labor intensity and low productivity, but also makes it difficult to guarantee the stability of product quality. [0003] In the existing technology, the production of flexible circuit boards is gradually introduced into the roll-to-roll production process. Although the production efficiency can be greatly improved by using this process, it will also introduce many problems, resulting in the roll-to-roll production process. Applied to the production of flexible circuit boards. For example: Micro-etch the side wall of the dril...
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IPC IPC(8): H05K3/00H05K3/26B65H43/00
CPCH05K3/0088H05K3/26B65H43/00
Inventor 谢安孙东亚李月婵曹春燕卢向军杨亮
Owner XIAMEN UNIV OF TECH