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Chemical mechanical polishing control method and equipment

A technology of chemical machinery and equipment, which is applied in the control field of chemical mechanical grinding, can solve the problems of fast loss of grinding pad dresser, etc., and achieve the effect of reducing loss and ensuring grinding rate

Pending Publication Date: 2021-09-03
SHANGHAI HUAHONG GRACE SEMICON MFG CORP
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The present application provides a chemical mechanical polishing control method and equipment, which can solve the problem that the chemical mechanical polishing control method provided in the related art uses the process parameters of the fixed polishing pad dresser to cause faster loss of the polishing pad dresser. question

Method used

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  • Chemical mechanical polishing control method and equipment
  • Chemical mechanical polishing control method and equipment
  • Chemical mechanical polishing control method and equipment

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Embodiment Construction

[0030] The technical solutions in this application will be clearly and completely described below in conjunction with the accompanying drawings. Apparently, the described embodiments are part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.

[0031] In the description of this application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" etc. The indicated orientation or positional relationship is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, use a specific orientati...

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Abstract

The invention discloses a chemical mechanical polishing control method and equipment. The method comprises the steps that the polishing rate and a current signal of a motor of a polishing pad trimmer are obtained; when the polishing rate is lower than the rate threshold value, an upper limit value and a lower limit value of the current signal corresponding to the polishing rate are obtained; and pressure applied to the polishing pad trimmer is adjusted such that the current signal is between the upper limit value and the lower limit value. The polishing rate and the current signal of the motor of the polishing pad trimmer are obtained, when the polishing rate is lower than the rate threshold value, the value range of the current signal is determined according to the polishing rate, and therefore the pressure applied to the polishing pad trimmer is adjusted according to the value range of the current signal, so that the current signal is within the value range, stability of the polishing rate is ensured, and then the loss of the polishing pad trimmer is reduced.

Description

technical field [0001] The present application relates to the technical field of semiconductor manufacturing, and in particular to a control method and equipment for chemical mechanical polishing (CMP). Background technique [0002] In the semiconductor manufacturing process, chemical mechanical polishing is a comprehensive planarization process. It absorbs the back of the silicon wafer through the polishing head, and applies a downward pressure to it to make it contact with the polishing pad. At the same time, the polishing liquid is added to the polishing pad. The relative movement of the polishing pad and the silicon wafer is used to achieve planarization. [0003] In chemical mechanical polishing, the polishing pad is an important consumable. As the carrier of the chemical mechanical polishing process, the state (roughness) of the polishing pad is directly related to the chemical mechanical polishing. In order to keep the polishing pad in good condition, chemical mechani...

Claims

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Application Information

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IPC IPC(8): B24B37/005B24B53/017
CPCB24B37/005B24B53/017
Inventor 林佳佳
Owner SHANGHAI HUAHONG GRACE SEMICON MFG CORP
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