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Double-sided copper foil single copper plating and circuit manufacturing method applied to ultrathin FCCL

A technology of double-sided copper foil and circuit production, which is used in printed circuit manufacturing, printed circuits, laminated printed circuit boards, etc.

Inactive Publication Date: 2021-09-03
ZHUHAI ALL WINNER FPC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a double-sided copper foil single-sheet copper plating and circuit manufacturing method applied to ultra-thin FCCL, aiming to solve the problem of reducing the risk of product wrinkles and deformation in the circuit board production process

Method used

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  • Double-sided copper foil single copper plating and circuit manufacturing method applied to ultrathin FCCL
  • Double-sided copper foil single copper plating and circuit manufacturing method applied to ultrathin FCCL
  • Double-sided copper foil single copper plating and circuit manufacturing method applied to ultrathin FCCL

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Embodiment Construction

[0037] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0038] It should be understood that when used in this specification and the appended claims, the terms "comprising" and "comprises" indicate the presence of described features, integers, steps, operations, elements and / or components, but do not exclude one or Presence or addition of multiple other features, integers, steps, operations, elements, components and / or collections thereof.

[0039] It should also be understood that the terminology used ...

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Abstract

The embodiment of the invention discloses a double-sided copper foil single copper plating and circuit manufacturing method applied to an ultra-thin FCCL. The method comprises the following steps that: cutting and drilling are performed; a reinforcing cover film is pasted and pressed, specifically, a first reinforcing cover film is pasted and pressed on the surface of a first copper layer, the first reinforcing cover film is provided with an avoiding area for exposing the circuit area of the first copper layer; black shadow treatment is performed; dry film pasting, exposure and development, selective copper plating, dry film removing; a dry film is pasted; exposure and development are performed; and etching is carried out, so that a product circuit is obtained. The structural strength of the product is enhanced through the first reinforcing cover film, so that the product is not easy to fold, and the phenomenon that the product is stuck on equipment in the subsequent process machining process is reduced, and the machining stability of the product is effectively improved; and on the other hand, the first reinforcing cover film makes the product hardly undergo tensile deformation in the subsequent process, so that the yield of the product is effectively improved.

Description

technical field [0001] The invention relates to the field of circuit board production technology, in particular to a double-sided copper foil sheet copper plating and circuit manufacturing method applied to ultra-thin FCCL. Background technique [0002] At present, with the application of products with high flexibility and bending resistance in the market, ordinary double-sided boards with conventional thickness PI materials and copper thickness materials cannot meet the dynamic bending performance of more than 100,000 consecutive times or more, because the more PI materials The thicker the copper, the greater the stress of itself, and the high-frequency bending will inevitably cause the copper wire on the material to break. [0003] PI (polyimide) material is characterized by low temperature resistance (-269~400°C), high friction resistance, self-lubricating, high strength, high insulation, radiation resistance, corrosion resistance, small thermal expansion coefficient, res...

Claims

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Application Information

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IPC IPC(8): H05K3/00
CPCH05K3/0058
Inventor 贺盛德周文君胡晓霞
Owner ZHUHAI ALL WINNER FPC
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