Temperature control equipment of outdoor cabinet and temperature control method thereof
A temperature control method and technology of temperature control equipment, which are applied in the construction parts of electrical equipment, cooling/ventilation/heating transformation, electrical components, etc., can solve the problem that the display screen of electronic equipment cannot work normally, affect the reliability of the service life, and affect the operation Problems such as the oil return of the system, to achieve the effect of reducing the frequency of maintenance and replacement, compact structure, and reducing energy consumption
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[0024] Such as figure 1 Be a kind of specific embodiment of the present invention, its structure comprises:
[0025] The semiconductor refrigeration module, the semiconductor refrigeration module includes a semiconductor chip 11, a first circulation pipeline 12 for cooling liquid, a second circulation circulation pipeline 13 for cooling fluid, and a second circuit for controlling the semiconductor chip 11 to be energized forwardly for cooling or reversely for heating or closed. A controller, the first circulation pipeline 12 is provided with the first circulation pump 14, the first heat exchanger 15 and the heat transfer end 16 in sequence, the second circulation pipeline 13 is provided with the second circulation pump 17, the second The heat exchanger 18 and the cold-conducting end 19, the heat-conducting end 16 is closely attached to the hot end surface of the semiconductor chip 11, and the cold-conducting end 19 is closely attached to the cold end surface of the semiconduct...
Embodiment 1
[0038] In this embodiment, the cabinet is in a low-temperature environment (the unsafe operating temperature of the compressor 22) as an example for illustration, that is, the selection method S1 for controlling the internal temperature of the cabinet is specifically described, wherein, t a The value is 22℃, t f The value is 25℃, t g The value is 5°C.
[0039] In method S1, when t c When ≤5°C, the first controller controls the semiconductor chip 11 to conduct reverse power heating and make the temperature inside the cabinet rise, 25°C≤t c , the first controller controls the semiconductor chip 11 to be energized and refrigerated to lower the temperature inside the cabinet, when 5°Cc When <25°C, the first controller controls the semiconductor chip 11 to be in a standby state.
[0040] In this embodiment, when the ambient temperature outside the cabinet is lower than 22°C, the external temperature environment itself is within the safe temperature range of the electronic compon...
Embodiment 2
[0046] In this embodiment, the cabinet is at a normal temperature (the safe operating temperature of the compressor 22) as an example for illustration, that is, the selection method S2 for controlling the internal temperature of the cabinet is specifically described, wherein, t a The value is 22℃, t f The value is 25℃, t j The value is 30°C,
[0047] In method S2, when 25℃≤t c ≤30°C, the first controller controls the semiconductor chip 11 to be energized for cooling and lowers the temperature inside the cabinet, and the second controller controls the compressor 22 to be in a standby state, when t c When >30°C, the first controller controls the semiconductor chip 11 to be energized to cool and reduce the temperature inside the cabinet, and the second controller synchronously controls the compressor 22 to turn on and cool the inside of the cabinet, and the compressor 22 cooperates with the semiconductor chip 11 To cool the inside of the cabinet, when t g c When <25°C, the fi...
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