Graphene conductive adhesive for bonding PTC (Positive Temperature Coefficient) heating sheet

A graphene and conductive adhesive technology, applied in the direction of adhesive types, conductive adhesives, non-polymer adhesive additives, etc., can solve problems such as poor heat resistance of silicone silicone

Inactive Publication Date: 2021-09-17
陆建华
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The disadvantage of this technical solution is: the heat-resistant effect of organic silicon silica gel is not good

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0013] Embodiment 1: A kind of graphene conductive adhesive used for bonding PTC heating sheet

[0014] A graphene conductive adhesive used for bonding PTC heating sheets (also known as metal semiconductor heating sheets)

[0015] Materials: Far-infrared emitter (dry powder), graphene powder, copper powder, polymer high temperature resistant glue, polymer high temperature resistant glue purchased from Beijing Zema New Technology Co., Ltd. ℃ Zema high temperature adhesive. In this embodiment, a 1200°C Zema high-temperature adhesive is specifically selected.

[0016] Proportion: 50 grams of far-infrared emitter (dry powder), 100 grams of graphene, 200 grams of copper powder, and 400 grams of high-temperature polymer glue.

[0017] How to use: Apply the adjusted slurry evenly on the electrode, then arrange the semiconductor heating sheet (or metal semiconductor heating sheet), and then cover another semiconductor electrode coated with the slurry, and put it in an electric oven ...

Embodiment 2

[0020] Embodiment 2: A kind of graphene conductive adhesive used for bonding PTC heating sheet

[0021] A kind of graphene conductive glue that is used for PTC heating sheet bonding, raw material formula comprises the raw material of following weight part: the far-infrared emission agent of 45 weight parts, the graphene of 90 weight parts, the copper powder of 180 weight parts, the copper powder of 400 weight parts The high temperature resistant polymer material; the high temperature resistant polymer material is a high temperature resistant phenolic resin. The high temperature resistant phenolic resin is specifically boron phenolic resin.

[0022] When in use, add the far-infrared emitter, graphene, and copper powder into the high-temperature-resistant phenolic resin, and stir it into a slurry.

Embodiment 3

[0023] Embodiment 3: A kind of graphene conductive adhesive for bonding PTC heating sheet

[0024] A kind of graphene conductive glue that is used for PTC heating sheet bonding, raw material formula comprises the raw material of following weight part: the far-infrared emitting agent of 55 weight parts, the graphene of 110 weight parts, the copper powder of 220 weight parts, the copper powder of 500 weight parts The high-temperature-resistant polymer material; the high-temperature-resistant polymer material is high-temperature-resistant glue. The high-temperature-resistant glue adopts the 1400°C-resistant glue disclosed by the publication number CN108359387.

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PUM

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Abstract

The invention discloses a graphene conductive adhesive for bonding a PTC (Positive Temperature Coefficient) heating sheet. The graphene conductive adhesive is prepared from the following raw materials in parts by weight: 45 to 55 parts of far infrared emitting agent, 90 to 110 parts of graphene, 180 to 220 parts of copper powder and 400 to 500 parts of high-temperature-resistant high polymer material, wherein the high-temperature-resistant high polymer material is at least one of high-temperature-resistant glue and high-temperature-resistant phenolic resin. According to the invention, a high-temperature-resistant high polymer material is used as an adhesive, so that the adhesive is not decomposed in a high-temperature state generated by the PTC heating element.

Description

technical field [0001] The invention belongs to the technical field of semiconductor heating materials, and relates to a graphene conductive adhesive used for bonding PTC heating sheets (or metal semiconductor heating sheets). Background technique [0002] PTC (Positive Temperature Coefficient) means positive temperature resistance coefficient, that is, the characteristic that the resistance increases with the increase of temperature. The material with this characteristic is called PTC material, and its resistance remains basically unchanged below the Curie temperature, while at Above the Curie temperature increases rapidly with increasing temperature. At present, PTC materials are mainly divided into titanate series, metal oxide series, and polymer series, among which barium titanate ceramics are the most commonly used. PTC heating element is a type of element that uses the Joule effect when current flows through the PTC material to generate heat. Compared with traditional...

Claims

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Application Information

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IPC IPC(8): C09J201/00C09J161/14C09J9/02C09J11/04
CPCC09J201/00C09J161/14C09J9/02C09J11/04C08K2003/085C08L2201/08C08L2203/206C08K3/042C08K3/08
Inventor 陆建华
Owner 陆建华
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