A High Performance Encapsulated Radiation Absorber
A radiation-absorbing, high-performance technology, applied to antennas, electrical components, etc., can solve problems such as the performance deterioration of metamaterial absorbers, and achieve the effect of reducing production costs
Active Publication Date: 2022-06-21
海宁利伊电子科技有限公司
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Problems solved by technology
When the absorber is applied to scenarios such as chip packaging, due to the complexity of the field distribution, the performance of the metamaterial absorber often deteriorates seriously, making how to improve the angular performance of the absorber becomes a big challenge
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[0040] The present invention will be further described below with reference to the accompanying drawings.
[0041] like figure 1 As shown, the absorber contains a number of closely arranged periodic unit structures, each periodic unit structure is mainly composed of a resonant unit, a layer of lossy dielectric layer and a layer of metal backplane stacked in sequence, the resonant layer and the metal backplane are respectively located in Both sides of the lossy dielectric layer.
[0042] like figure 2 As shown, the periodic cell structure includes the top resonant cell P 1 , lossy dielectric layer D 2 and the bottom metal backplane G; the top resonant unit P 1 Attached to the lossy dielectric layer D 2 On the upper surface, the underlying metal backplane G is attached to the lossy dielectric layer D 2 Lower surface; resonant unit P 1 It is mainly composed of one dielectric layer, two metal layers and metal vias connecting the two metal layers, wherein the two metal lay...
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The invention discloses a high-performance packaging radiation absorbing structure. Contains a plurality of closely arranged periodic unit structures. Each periodic unit structure is mainly composed of a resonant unit, a layer of lossy dielectric layer and a layer of metal backplane. On both sides; the periodic unit structure includes a top resonant unit, a lossy dielectric layer and a bottom metal backplane; the resonant unit is mainly composed of a dielectric layer, two metal layers and metal vias connecting the two metal layers, The two metal layers are attached to the two surfaces of the dielectric layer respectively; the metal via holes pass through the dielectric layer to electrically connect the two metal layers. The invention is suitable for suppressing the radiation absorption of packaged devices at specific frequency points, has excellent angular stability, and has good radiation absorption capacity at design frequency points, thereby increasing reflection loss and improving EMI benefits of packaged devices.
Description
technical field [0001] The invention relates to an electromagnetic wave radiation structure in the technical field of metamaterial absorbers, in particular to a high-performance full-angle insensitive package radiation absorption structure, which can be applied to on-chip and off-chip modern commercial communications, packaged products or chips Device radiation suppression. Background technique [0002] Metamaterial absorber is a kind of electromagnetic wave absorber material using metamaterial structure, which converts electromagnetic energy into other forms of energy such as heat energy by means of electromagnetic wave absorption instead of reflection or transmission, so as to realize the loss of electromagnetic wave. This property is mostly used in the military field to reduce the radar cross section of the aircraft. [0003] The research on the absorber originated from the Salisbury screen. Its structure is to place a thin resistive layer at a distance of 1 / 4 wavelength...
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IPC IPC(8): H01Q17/00H01Q15/00
CPCH01Q17/00H01Q15/0086
Inventor 李尔平樊宇迪李天武
Owner 海宁利伊电子科技有限公司