Silicon wafer edge roughness detection jig and detection method

Abstract

The embodiment of the invention provides a silicon wafer edge roughness detection jig and a detection method. The silicon wafer edge roughness detection jig comprises a base and a clamping component; the base isused for bearing a silicon wafer sample, the base comprises a horizontal bottom surface and an inclined bearing surface, a preset included angle alpha is formed between the horizontal bottom surface and the inclined bearing surface, and alpha is larger than 0 and smaller than or equal to 90 degrees; and the clamping component is used for clamping and fixing the silicon wafer sample, and the clamping component is arranged on the inclined bearing surface. According to the silicon wafer edge roughness detection jig and the detection method provided by the embodiment of the invention, the roughness and the surface appearance of the edge of a silicon wafer can be evaluated, the measurement error can be reduced, and the test reliability can be ensured.

Description

technical field [0001] The invention relates to the technical field of semiconductor processing, in particular to a silicon chip edge roughness detection jig and a detection method. Background technique [0002] In recent years, the demand for large-diameter silicon wafers has increased dramatically, and issues related to the edge of silicon wafers in semiconductor production have received extensive attention. In the processing and production of silicon wafers, there are two main problems on the edge of silicon wafers: one is that the silicon wafers are broken due to tiny nicks and cracks caused by corrosion; the other is that dust particles and foreign matter adhere to the edges of silicon wafers. These two problems often lead to a decrease in the yield rate of the chip during the chip manufacturing process, so it is very important to have a defect-free smooth surface on the edge of the silicon chip. [0003] In the related art, the surface roughness of the silicon wafer i...

AI Technical Summary

Problems solved by technology

In the processing and production of silicon wafers, there are two main problems on the edge of silicon wafers: one is that the silicon wafers are broken due to tiny nicks and cracks caused by corrosion;

[0003] In the related art, the surface roughness of the silicon wafer is detected by using an atomic force microscope (AFM). However, this method can only detect the roughness of the surface of the silicon wafer, and cannot detect the roughness and edge surface state detection

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