Machine table gas path flow adjusting system and method

Abstract

The invention discloses a machine gas path flow adjusting system and method. The machine gas path flow adjusting system comprises a machine table goods running task prediction unit, a gas path flow monitoring unit and a gas path flow control unit; the machine table goods running task prediction unit predicts a goods running time table of a machine table; the gas path flow monitoring unit is used for monitoring the gas path flow of the machine table in real time; the gas path flow control unit is in communication connection with the machine table goods running task prediction unit and the gas path flow monitoring unit; the gas path flow control unit is used for judging whether the gas path flow exceeds a preset flow range or not according to the gas path flow; and when the gas path flow exceeds the preset flow range, the gas path flow control unit judges the current goods running state of the machine table according to the goods running time table provided by the machine table goods running task prediction unit and makes a corresponding flow control instruction according to the goods running state. According to the machine table gas path flow adjusting system and method, the problems that an existing gas path flow adjusting method delays the goods running process and is complex in operation are solved.

Description

technical field [0001] The invention relates to the technical field of semiconductor measuring equipment, in particular to a system and method for adjusting the air flow rate of a machine. Background technique [0002] In each stage of the semiconductor manufacturing process, the photolithography process is the most important link. The purpose of the photolithography process is to form a patterned photoresist (Photo Resist, PR), and then use the patterned photoresist as a mask to etch the exposed material layer, thereby patterning the material layer. When the critical dimension (Critical Dimension, CD) of the patterned material layer. Changes in critical dimensions have a major impact on the characteristics of electronic components. In order to ensure the quality of electronic components, it is necessary to measure critical dimensions after the photolithography process. [0003] When measuring critical dimensions, it is necessary to place the wafer to be measured on a CD m...

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Problems solved by technology

[0005] The embodiment of the present invention provides a machine gas flow adjustment system and method to solve the problem that the existing gas flow adjustment scheme delays the delivery process and complicates the operation

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