Semiconductor substrate processing equipment
A processing equipment and semiconductor technology, applied in the fields of semiconductor devices, semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, etc., can solve the problems of easy accumulation of semiconductor substrates, affecting cleaning efficiency, difficult to clean at the same time, etc., to achieve enhanced brushing effect, enhanced cleaning effect, enhanced effect effect
Inactive Publication Date: 2021-10-22
汪剑敏
View PDF0 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0004] Aiming at the deficiencies of the prior art, the present invention provides a semiconductor substrate processing equipment, which solves the problem that it is difficult for general cleaning devices to wipe the surface of the substrate comprehensively, and the semiconductor substrates are easy to accumulate and gather, making it difficult to clean the substrate. A large number of simultaneous cleaning, which affects the cleaning efficiency to a certain extent
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0028] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0029] Such as Figure 1-7 As shown, the embodiment of the present invention provides a semiconductor substrate processing equipment, including a cleaning bucket 1 for cleaning the semiconductor substrate, a support leg 2, and a flip cleaning mechanism 3 for controlling the semiconductor substrate. The bottom of the cleaning bucket 1 The support leg 2 is fixedly connected, the flap cleaning mechanism 3 is set on the cleaning bucket 1, the bottom of the cleaning bucket 1 is sle...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention provides semiconductor substrate processing equipment which comprises a cleaning barrel used for cleaning a semiconductor substrate, supporting legs and a turning plate cleaning mechanism used for controlling the semiconductor substrate. The bottom of the cleaning barrel is fixedly connected with the supporting legs, and the turning plate cleaning mechanism is arranged on the cleaning barrel. The bottom of the cleaning barrel is sleeved with a water drainage pipe, and a control valve is installed at the bottom end of the water drainage pipe.The invention relates to the field of substrate processing. According to the semiconductor substrate processing equipment, a special structure which can continuously sprint two side surfaces of a substrate for comprehensive scrubbing and can repeatedly jolt the substrate to avoid gathering is designed according to the problems that the semiconductor substrate is easy to accumulate and difficult to comprehensively clean in the conventional semiconductor substrate cleaning process; therefore, the problems that when a common cleaning device is used for cleaning the substrates, the surfaces of the substrates are difficult to comprehensively wipe, the semiconductor substrates are easy to accumulate and gather, a large number of the substrates are difficult to clean at the same time, and then the cleaning efficiency is influenced to a certain extent are effectively solved.
Description
technical field [0001] The invention relates to the technical field of substrate processing, in particular to semiconductor substrate processing equipment. Background technique [0002] When the size of the semiconductor substrate is continuously reduced, the integration degree of the surface is continuously increased, and some particle pollutants will be generated during the processing of the substrate. The existence of these pollutants will affect the subsequent processing, so the processing of the substrate will Choose to clean it. At present, the commonly used cleaning methods are ultrasonic cleaning and chemical cleaning. It is easy to accumulate, which will affect the cleaning effect, and the surface structure of the substrate is complex, and it is not easy to effectively scrub the inside during cleaning. It is difficult for general cleaning devices to wipe the surface comprehensively when cleaning the substrate. Moreover, semiconductor substrates are easy to pile up,...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/02H01L21/673H01L21/687H01L23/12
CPCH01L21/67046H01L21/67057H01L21/6704B08B3/12B08B13/00B08B1/12
Inventor 汪剑敏
Owner 汪剑敏