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Method for increasing adhesive force of printing ink on ceramic substrate

A technology of ceramic substrates and copper-clad ceramic substrates, which is applied in the post-processing of printing, lithography/patterning, printing, etc., can solve the problems of poor product reliability, ink shedding, etc., achieve convenient production operations, increase adhesion, and improve processing and the effect of using the yield rate

Active Publication Date: 2021-10-22
江西晶弘新材料科技有限责任公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Because the surface treatment of the ceramic substrate with ink in a strong acid environment and the high temperature treatment in the packaging process will cause the ink to fall off, resulting in poor product reliability

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] A method for increasing ink adhesion on a ceramic substrate, comprising the following steps:

[0032] (1) The copper-clad ceramic substrate to be used for ink is subjected to sandblasting and etching roughening treatment. The number of corundum used for sandblasting is 200 mesh, the sandblasting pressure is 2.0Mpa, and etching potion is used for etching, so that the copper-clad ceramic substrate The roughness is greater than 0.15 microns. The etching liquid is sodium persulfate and sulfuric acid, the concentration of sodium persulfate is 5g / L, and the mass concentration of the sulfuric acid is 1%.

[0033] (2) Place the roughened copper-clad ceramic substrate in a cleaning solution for ultrasonic cleaning for 30 minutes. The cleaning solution includes the following components in mass percentage: 35% alcohol, 10% acetone, and the rest is deionized water.

[0034] (3) The cleaned copper-clad ceramic substrate is taken out and baked in an oven at 50° C. for 50 minutes. ...

Embodiment 2

[0041] A method for increasing ink adhesion on a ceramic substrate, comprising the following steps:

[0042] (1) The copper-clad ceramic substrate to be used for ink is subjected to sandblasting and etching roughening treatment. The number of emery used for sandblasting is 800 mesh, the sandblasting pressure is 5.0Mpa, and etching potion is used for etching, so that the copper-clad ceramic substrate The roughness is greater than 0.15 microns. The etching liquid is sodium persulfate and sulfuric acid, the concentration of sodium persulfate is 60g / L, and the mass concentration of the sulfuric acid is 20%.

[0043] (2) Place the roughened copper-clad ceramic substrate in a cleaning solution for ultrasonic cleaning for 60 min. The cleaning solution includes the following components in mass percentage: 5% alcohol, 2% acetone, and the rest is deionized water.

[0044] (3) The cleaned copper-clad ceramic substrate is taken out and baked in an oven at 100° C. for 10 minutes.

[004...

Embodiment 3

[0051] A method for increasing ink adhesion on a ceramic substrate, comprising the following steps:

[0052] (1) The copper-clad ceramic substrate to be used for ink is subjected to sandblasting and etching roughening treatment. The number of corundum used for sandblasting is 500 mesh, the sandblasting pressure is 6.0Mpa, and etching potion is used for etching, so that the copper-clad ceramic substrate The roughness is greater than 0.15 microns. The etching liquid is sodium persulfate and sulfuric acid, the concentration of sodium persulfate is 20g / L, and the mass concentration of the sulfuric acid is 10%.

[0053] (2) Place the roughened copper-clad ceramic substrate in a cleaning solution for ultrasonic cleaning for 35 minutes. The cleaning solution includes the following components in mass percentage: 15% alcohol, 5% acetone, and the rest is deionized water.

[0054](3) The cleaned copper-clad ceramic substrate is taken out and baked in an oven at 70° C. for 60 minutes. ...

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Abstract

The invention discloses a method for increasing adhesive force of printing ink on a ceramic substrate. The method comprises the following steps: (1) carrying out sand blasting and etching roughening treatment on the copper-clad ceramic substrate to be printed, adopting 200-800 meshes of carborundum during sand blasting and the sand blasting pressure of 2.0-6.0 Mpa, and adopting an etching liquid medicine during etching, so that the roughness of the copper-clad ceramic substrate is more than 0.15 microns; (2) putting the coarsened copper-clad ceramic substrate in a cleaning solution to be subjected to ultrasonic cleaning for 30-60 min; (3) taking out the cleaned copper-coated ceramic substrate, and baking the copper-coated ceramic substrate in an oven at 50-100 DEG C for 10-60 minutes. The printing ink is formed on the ceramic substrate by adopting the method, and the adhesive force of the printing ink on the ceramic substrate can be effectively increased, so that a product can be processed and used in a harsh environment, the processing and using yield of the product is improved, and convenience is brought to production operation.

Description

technical field [0001] The invention relates to the technology in the field of ceramic substrates, in particular to a method for increasing the adhesion of ink on a ceramic substrate. Background technique [0002] With the development of integration and miniaturization of semiconductor devices, the precision requirements for circuit patterns on ceramic substrates carrying chips are also getting higher and higher, resulting in certain requirements for the adhesion of inks made on substrates with high circuit resolution, especially Higher challenges are presented for ink adhesion with small linewidths on ceramic substrates. Because the surface treatment of the ceramic substrate with ink in a strong acid environment and the high temperature treatment in the packaging process will cause the ink to fall off, resulting in poor product reliability. Therefore, it is necessary to study a scheme to solve the above problems. Contents of the invention [0003] In view of this, the p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00B41M1/34B41M7/00
CPCH05K3/00B41M1/34B41M7/009B41M7/00H05K2203/0502
Inventor 孔仕进郭晓泉何浩波康为
Owner 江西晶弘新材料科技有限责任公司
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