Method for increasing adhesive force of printing ink on ceramic substrate
A technology of ceramic substrates and copper-clad ceramic substrates, which is applied in the post-processing of printing, lithography/patterning, printing, etc., can solve the problems of poor product reliability, ink shedding, etc., achieve convenient production operations, increase adhesion, and improve processing and the effect of using the yield rate
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Embodiment 1
[0031] A method for increasing ink adhesion on a ceramic substrate, comprising the following steps:
[0032] (1) The copper-clad ceramic substrate to be used for ink is subjected to sandblasting and etching roughening treatment. The number of corundum used for sandblasting is 200 mesh, the sandblasting pressure is 2.0Mpa, and etching potion is used for etching, so that the copper-clad ceramic substrate The roughness is greater than 0.15 microns. The etching liquid is sodium persulfate and sulfuric acid, the concentration of sodium persulfate is 5g / L, and the mass concentration of the sulfuric acid is 1%.
[0033] (2) Place the roughened copper-clad ceramic substrate in a cleaning solution for ultrasonic cleaning for 30 minutes. The cleaning solution includes the following components in mass percentage: 35% alcohol, 10% acetone, and the rest is deionized water.
[0034] (3) The cleaned copper-clad ceramic substrate is taken out and baked in an oven at 50° C. for 50 minutes. ...
Embodiment 2
[0041] A method for increasing ink adhesion on a ceramic substrate, comprising the following steps:
[0042] (1) The copper-clad ceramic substrate to be used for ink is subjected to sandblasting and etching roughening treatment. The number of emery used for sandblasting is 800 mesh, the sandblasting pressure is 5.0Mpa, and etching potion is used for etching, so that the copper-clad ceramic substrate The roughness is greater than 0.15 microns. The etching liquid is sodium persulfate and sulfuric acid, the concentration of sodium persulfate is 60g / L, and the mass concentration of the sulfuric acid is 20%.
[0043] (2) Place the roughened copper-clad ceramic substrate in a cleaning solution for ultrasonic cleaning for 60 min. The cleaning solution includes the following components in mass percentage: 5% alcohol, 2% acetone, and the rest is deionized water.
[0044] (3) The cleaned copper-clad ceramic substrate is taken out and baked in an oven at 100° C. for 10 minutes.
[004...
Embodiment 3
[0051] A method for increasing ink adhesion on a ceramic substrate, comprising the following steps:
[0052] (1) The copper-clad ceramic substrate to be used for ink is subjected to sandblasting and etching roughening treatment. The number of corundum used for sandblasting is 500 mesh, the sandblasting pressure is 6.0Mpa, and etching potion is used for etching, so that the copper-clad ceramic substrate The roughness is greater than 0.15 microns. The etching liquid is sodium persulfate and sulfuric acid, the concentration of sodium persulfate is 20g / L, and the mass concentration of the sulfuric acid is 10%.
[0053] (2) Place the roughened copper-clad ceramic substrate in a cleaning solution for ultrasonic cleaning for 35 minutes. The cleaning solution includes the following components in mass percentage: 15% alcohol, 5% acetone, and the rest is deionized water.
[0054](3) The cleaned copper-clad ceramic substrate is taken out and baked in an oven at 70° C. for 60 minutes. ...
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