Semiconductor silicon wafer manufacturing and processing system and processing technology

Abstract

The invention relates to a semiconductor silicon wafer manufacturing and processing system and a processing technology. Gluing work during wafer manufacturing and processing is completed through cooperation of a workbench, a supporting plate, a fixing device and a glue uniformizing device. The semiconductor silicon wafer manufacturing and processing system and the processing technology provided by the invention can solve problems that when an existing wafer manufacturing and processing system is used for coating photoresist on the surface of a wafer, the existing wafer manufacturing and processing system is generally used for directly coating the photoresist and does not uniformly coat the photoresist after being coated; problems that the photoresist on the surface of a wafer is not uniformly smeared due to the fact that the photoresist on the surface of the wafer has protrusions, micro-grains and scratches, and when the photoresist is directly and uniformly smeared by an existing wafer manufacturing and processing system, the accumulated photoresist is difficult to spread and uniformly smear in time, so that the time of the photoresist uniform smearing process is long, and the wafer manufacturing efficiency is reduced are solved.

Description

technical field [0001] The invention relates to the technical field of wafer manufacturing, in particular to a semiconductor silicon wafer manufacturing and processing system and processing technology. Background technique [0002] Wafer refers to the silicon wafer used in the production of silicon semiconductor integrated circuits. Because of its circular shape, it is called a wafer; various circuit structures can be processed on the silicon wafer, and become IC products with specific electrical functions. . The raw material of the wafer is silicon, and the surface of the earth’s crust is inexhaustible silicon dioxide. The silicon dioxide ore is refined through an electric arc furnace, chlorinated with hydrochloric acid, and distilled to produce high-purity polysilicon. The polysilicon is melted and drawn Single crystal silicon rods are produced, and then cut into thin wafers. After the wafer is fabricated, photoresist is evenly applied to the surface of the wafer to faci...

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Problems solved by technology

[0004] (1) When the existing semiconductor silicon wafer manufacturing and processing system applies photoresist to the surface of the wafer, usually the existing wafer manufacturing and processing system directly applies the photoresist to the photoresist, and does not apply the applied photoresist Apply evenly, so that the photoresist on the surface of the wafer is unevenly applied, resulting in protrusions, micrograins and scratches on the photoresist on the surface of the wafer;

[0005] (2) When the photoresist is applied to the surface of the wafer through the existing semiconductor silicon wafer manufacturing and processing system, after the glue is placed on the wafer surface, the photoresist is usually directly applied to the photoresist through the existing wafer manufacturing and processing system , when directly coating evenly, it is difficult to spread and spread the accumulated photoresist in time, which makes the photoresist coating process take a long time and reduces the efficiency of wafer manufacturing

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