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Low-temperature fast-curing epoxy structural adhesive and preparation method thereof

An epoxy structural adhesive, fast curing technology, applied in the field of structural adhesives, can solve the problems of long curing time, difficult to adapt to large-scale production, fast efficiency, etc., to achieve fast curing speed, excellent impact resistance and long service life. Effect

Active Publication Date: 2021-11-02
江苏矽时代材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Epoxy resin has high adhesion to a wide range of substrates. Generally speaking, the curing temperature of epoxy products is above 100°C, and the curing time is relatively long, which is difficult to adapt to modern production scale and efficiency. fast request

Method used

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  • Low-temperature fast-curing epoxy structural adhesive and preparation method thereof

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preparation example Construction

[0037] The preparation method of low-temperature fast-curing epoxy structural adhesive of the present invention comprises the following steps:

[0038] (1) Pass bisphenol F epoxy resin, secondary mercaptan, meteorological silica and silicon micropowder through a three-roll mill, adjust the distance between the front and rear rollers to 20 μm and 10 μm, and grind 3 to 5 times to obtain a grinding mixture (Visual inspection without uniform objects);

[0039] (2) Add the grinding mixture, plasticizer, latent curing agent and polymerization inhibitor into the planetary reactor, adjust the vacuum degree and temperature of the planetary reactor, stir until no bubbles are generated, let stand, and exhaust.

[0040] In addition, what needs to be added is: the vacuum degree of the planetary reactor is -0.11-0.09MPa, and the temperature is 15-20°C.

[0041] Before the bisphenol F epoxy resin passes through the three-roll mill, in order to avoid its crystallization in low temperature cl...

Embodiment 1

[0043] This embodiment provides a low-temperature fast-curing epoxy structural adhesive, and its raw material composition includes:

[0044] Bisphenol F epoxy resin 43%; (Jer YL983U, epoxy equivalent is 160g / mol)

[0045] Plasticizer 6%; (acetyl tri-n-butyl citrate)

[0046] Secondary mercaptan 18%; (Youyang tetrakis (3-mercaptobutyric acid) pentaerythritol ester)

[0047] Latent curing agent 8%; (PN23 of Ajinomoto)

[0048] Fumed silica 2%; (Degussa fumed silica AEROSIL 200)

[0049] Inhibitor 0.3%; (methyl hydroquinone (MHQ))

[0050] Silica powder 22.7%. (Silverbond925)

[0051] Its preparation method is:

[0052] (1) Pass the formula amount of Jer YL983U, Youyang tetrakis (3-mercaptobutyrate) pentaerythritol ester, Degussa fumed silica AEROSIL 200 and Silverbond925 through the three-roll mill, and adjust the distance between the front and rear rollers to be 20 μm and 10 microns, grind 3-5 times to obtain a grinding mixture (no inhomogeneity by visual inspection);

...

Embodiment 2

[0057] This embodiment provides a low-temperature fast-curing epoxy structural adhesive, and its raw material composition includes:

[0058] Bisphenol F epoxy resin 40.7%; (Jer YL983U, epoxy equivalent is 160g / mol)

[0059] Plasticizer 6%; (acetyl tri-n-butyl citrate)

[0060] Secondary mercaptan 18%; (Youyang tetrakis (3-mercaptobutyric acid) pentaerythritol ester)

[0061] 10% latent curing agent; (PN23 of Ajinomoto)

[0062] Fumed silica 2%; (Degussa fumed silica AEROSIL 200)

[0063] Inhibitor 0.3%; (methyl hydroquinone (MHQ))

[0064] Silica powder 23%. (Silverbond925)

[0065] The preparation process of embodiment 2 and embodiment 1 is the same.

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Abstract

The invention provides a low-temperature fast-curing epoxy structural adhesive and a preparation method thereof. The low-temperature fast-curing epoxy structural adhesive comprises the following raw materials in percentage by mass: 35%-43% of bisphenol F epoxy resin, 5%-6% of a plasticizer, 18%-20% of secondary mercaptan, 8%-12% of a latent curing agent, 1%-2% of fumed silica, 0.2%-0.5% of a polymerization inhibitor and 20%-24% of silica powder, wherein the sum of the total mass of all the raw materials of the low-temperature fast-curing epoxy structural adhesive is 100%. The invention also provides a preparation method of the structural adhesive. The low-temperature fast-curing epoxy structural adhesive disclosed by the invention has good cold and hot impact resistance and relatively good substrate bonding force.

Description

technical field [0001] The invention relates to a structural adhesive, in particular to an epoxy structural adhesive that can be quickly cured at low temperature, and belongs to the technical field of structural adhesives. Background technique [0002] Epoxy resin has high adhesion to a wide range of substrates. Generally speaking, the curing temperature of epoxy products is above 100°C, and the curing time is relatively long, which is difficult to adapt to modern production scale and efficiency. Quick request. Contents of the invention [0003] In order to solve the above technical problems, the object of the present invention is to provide a structural adhesive that can be cured rapidly at low temperature and a preparation method thereof. [0004] In order to achieve the above technical purpose, the present invention provides a low-temperature fast-curing epoxy structural adhesive, based on the sum of the total mass of the raw materials of the low-temperature fast-curin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J11/04C09J11/06
CPCC09J163/00C09J11/04C09J11/06C08K2201/003C08K5/11C08K5/37C08K7/26C08K3/36
Inventor 杨晖宇柯明新李朝军
Owner 江苏矽时代材料科技有限公司
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