A processing technology for increasing copper thickness of circuit board via holes
A processing technology and via hole technology, which is applied in the field of processing technology for increasing the copper thickness of the via hole of the circuit board, can solve the problems such as the increase of the thickness of the base copper of the copper clad laminate, the PCB board does not meet the production standard, and the thickness of the copper clad laminate is exceeded. Achieve the effects of increasing copper thickness, reducing the possibility of poor production, and improving production efficiency
Active Publication Date: 2022-08-02
勤基电路板(深圳)有限公司
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Problems solved by technology
However, when the hole wall is copper-plated through PTH, the thickness of the base copper on both sides of the copper-clad laminate will also increase, which will easily cause the thickness of the copper-clad laminate to exceed the thickness specified by the PCB, resulting in the resulting PCB board not meeting the production standards.
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[0061] Attached to the following Figure 1-8 This application will be described in further detail.
[0062] The embodiment of the present application discloses a process for increasing the copper thickness of a circuit board via hole.
[0063] refer to figure 1 , a processing technology for increasing the copper thickness of a circuit board via hole, comprising the following steps:
[0064] In step S1, the material is cut, and the entire copper clad laminate is cut to form a sub-board 1 that can be produced on the production line.
[0065] Step S2, drilling. According to the design of the PCB, the sub-board 1 is drilled with the aid of drilling equipment. Each drilling can form circular holes 11 penetrating both sides of the sub-board 1 .
[0066] In step S3, PTH copper is immersed, and the sub-board 1 is immersed in the copper sinking tank, and the insulating layer 18 inside the sub-board 1 undergoes a redox reaction, so that the inner wall of the circular hole 11 of the i...
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The present application relates to a process for increasing the copper thickness of a circuit board via hole. Copper plating; S6, first dry film stripping; S7, grinding plate; S8, whole board copper plating; S9, dry film transfer circuit pattern; S10, surface etching; S11, second dry film stripping. The processing technology for increasing the copper thickness of the circuit board via hole of the present application greatly increases the copper thickness of the inner wall of the circular hole by performing copper plating on the inner wall of the circular hole three times, and improves the stability of the copper conduction on both sides; Electroplating only one time on both sides of the daughter board is beneficial for the thickness of the processed daughter board to be within the limited PCB thickness and in line with production standards.
Description
technical field [0001] The present application relates to the technical field of circuit board processing, and in particular, to a processing technology for increasing the copper thickness of a circuit board via hole. Background technique [0002] Printed circuit board, also known as PCB, is a carrier that electrically connects electronic components. The production of PCB is inseparable from the copper clad laminate. As the upstream core raw material of the PCB, the copper clad laminate is made into the PCB after a series of processing. CCL generally includes an insulating layer and base copper covering both sides of the insulating layer; CCL can be divided into thin copper plate and thick copper plate according to its own thickness, wherein the thickness of thick copper plate is thicker than that of thin copper plate. [0003] At present, the output of thin copper plates on the market is becoming less and less, and the copper clad plate used more in PCB production and proc...
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IPC IPC(8): H05K3/42
CPCH05K3/423
Inventor 许剑明宁娜
Owner 勤基电路板(深圳)有限公司