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Manufacturing method for improving PCB circuit height to width ratio
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A production method and high-width ratio technology, which is applied in the field of improving the high-width ratio of PCB lines, can solve problems such as large line height restrictions, and achieve the effects of improving integration density and stability, easy implementation, and stable lines
Inactive Publication Date: 2017-07-18
AKM ELECTRONICS TECH SUZHOU
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Abstract
Description
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Problems solved by technology
However, the height of the line in this method is greatly limited by the photosensitive material, and the H / W value is often less than 1.0
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Embodiment 1
[0038] see Figure 1 to Figure 2 , a manufacturing method for improving the aspect ratio of a PCB circuit in the present embodiment, comprising the following manufacturing steps:
[0039] Step S1: Substrate opening
[0040] The double-sided copper-clad substrate is cut and cut, and the laser drilling method is used to drill positioning holes on the substrate with a hole diameter of 2mm.
[0042] The base material after the hole is roughened, and then a 25µm thick film dry film is pasted on it, and the designed circuit pattern is exposed using the exposure equipment, and the line width and line spacing of the pattern are 10µm.
[0043] Step S3: Developing treatment
[0044] The exposed film substrate is developed to remove the unexposed part of the dry film.
[0045] Step S4: Graphic plating
[0046] Using pattern electroplating, the designed circuit is electroplated on the base material that has been developed in step S3, and the thickness...
Embodiment 2
[0054] see figure 1 and image 3 , a manufacturing method for improving the aspect ratio of a PCB circuit in the present embodiment, comprising the following manufacturing steps:
[0055] Step S1: Substrate opening
[0056] The pure copper foil is cut and cut, and the positioning hole is drilled on the substrate by the method of mechanical drilling, and the hole diameter is 2mm.
[0058] The base material after the opening is subjected to medium roughening treatment, and a 25µm thick film dry film is pasted on it, and the designed circuit pattern is exposed using an exposure device. The line width and line spacing of the pattern is 20µm, and a circuit board is obtained.
[0059] Step S3: Developing treatment
[0060] The exposed film substrate is developed to remove the unexposed part of the dry film.
[0061] Step S4: Graphic plating
[0062] Using pattern electroplating, the designed circuit is electroplated on the base material that has ...
Embodiment 3
[0071] see Figure 1 to Figure 2 , a manufacturing method for improving the aspect ratio of a PCB circuit in the present embodiment, comprising the following manufacturing steps:
[0075] After the substrate has been roughened, a 25µm thick film dry film is pasted on it, and the designed circuit pattern is exposed using an exposure device. Disc positioning hole for alignment.
[0076] Step S3: Developing treatment
[0077] The exposed film substrate is developed to remove the unexposed part of the dry film.
[0078] Step S4: Graphic plating
[0079] Using pattern electroplating, the designed circuit is electroplated on the base material that has been developed in step S3, and the thickness of copper plating is 25 μm to obtain a circuit board.
[0080] Step S5: Second photo-induced pretreatment
[0081] The circuit board after electroplating is subje...
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Abstract
The invention discloses a manufacturing method for improving a PCB circuit height to width ratio. The method comprises the following steps: 1) a base material is bored; 2) circuit design is conducted, photosensitive material is pasted on the bored base material after the bored base material is subjected to photoinduced pretreatment, and a designed circuit figure is exposed; 3) in a step of developing operation, the exposed base material on which a film is attached is subjected to developing operation; 4) in a step of figure electroplating, a designed circuit is electroplated on the base material after the developing operation; 5) secondary photoinduced pretreatment is performed; 6) in a step of secondary figure electroplating, the photosensitive material is again attached onto a right side of a circuit board, and a second layer circuit is manufactured via secondary developing operation and the secondary figure electroplating; 7) in a step of film stripping and etching, the obtained circuit board is subjected to film stripping and etching operation, and a precision circuit of high copper thickness is obtained. According to the method disclosed in the invention, at least two times of photosensitive material attaching operation, exposing operation, developing operation, surface treatment and copper electroplating, nickel electroplating or re-electroplating of alloy of copper and nickel are conducted; limitation posed on a circuit height to width ratio by the photosensitive material is removed, the copper thickness of the circuit is effectively improved, and the manufacturing method is easy to implement and is suitable for batch production.
Description
technical field [0001] The invention belongs to the technical field of printed circuits, and in particular relates to a manufacturing method for improving the aspect ratio of PCB lines. Background technique [0002] With the rapid development of semiconductor packaging technology and the rapid improvement of packaging density and chip performance, the corresponding pin density gradually increases, which requires the corresponding packaging substrate to have more dense integrated circuits. However, when the line is too thin, the heat will be severe, which will bring huge hidden dangers in functionality, reliability and safety. In addition, in some special functional circuits, such as inductance coils, there are strict high-density requirements for the line width and spacing of the substrate circuit, but it is hoped that the overall resistance of the circuit can be reduced as much as possible. Therefore, it is urgent to increase the height of the line and increase the cross-s...
Claims
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Application Information
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