Flexible optoelectronic device
An optoelectronic device, flexible technology, applied in the direction of the conductive layer on the circuit, electrical components, insulating carrier, etc., can solve the problems of rough surface of the conductive film layer, unfavorable substrate adhesion, poor conductivity, etc., to achieve optimal conductive effect , Reduce the possibility of vulnerability, improve toughness and protective effect
Pending Publication Date: 2021-11-09
长春电子科技学院
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Problems solved by technology
[0002] Flexible electronics can be summarized as an emerging electronic technology in which organic / inorganic material electronic devices are fabricated on flexible / ductile plastic or thin metal substrates. With its unique flexibility / extensibility and efficient, low-cost manufacturing processes, such as flexible electronic displays , printed RFID and electronic surface paste, etc., due to the rough surface of the conductive film layer, it is not conducive to bonding with the substrate, resulting in poor adhesion and affecting the performance of the device. Only relying on the substrate for single conduction, The electrical conductivity is not good, and because there are no protection measures, the possibility of the device being vulnerable is increased, and the protection is poor
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Embodiment 1
[0039] Such as figure 1 and Figure 4 shown;
[0040] A flexible optoelectronic device includes a substrate 10 and a conductive film layer 11 bonded and fixed on the upper surface of the substrate 10 .
[0041] In this embodiment: the main body of the flexible optoelectronic device is composed of a substrate 10 and a conductive thin film layer 11. The existing flexible optoelectronic device main body has a rough surface of the conductive thin film layer 11, which is not conducive to bonding with the substrate 10, resulting in For the problem of poor adhesion, a performance optimization component 20 is added to this solution.
[0042] further:
[0043] In combination with the above content: the flexible optoelectronic device includes a performance optimization component 20 arranged between the substrate 10 and the conductive thin film layer 11 for performance optimization. The performance optimization component 20 includes an elastic flexible support film 21, an organic buff...
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The invention belongs to the technical field of flexible electronics, and particularly relates to a flexible optoelectronic device. The optoelectronic device comprises a substrate, a conductive thin film layer fixed to the upper surface of the substrate in an adhesive mode, and a performance optimization assembly arranged between the substrate and the conductive thin film layer and used for performance optimization. The performance optimization assembly comprises an elastic flexible support film, an organic buffer layer and a first bonding layer, and the elastic flexible support film and the organic buffer layer are bonded and fixed between the substrate and the conductive film layer from bottom to top; the organic buffer layer enhances the flatness of the bottom surface of the conductive thin film layer and enlarges the bonding contact surface of the conductive thin film layer and the substrate, the elastic flexible supporting film enhances the supporting performance of the substrate, and the first bonding layer and the second bonding layer are matched to improve the bonding of the elastic flexible supporting film and the organic buffer layer; meanwhile, the first bonding layer and the second bonding layer on the bottom surface of the elastic flexible supporting film and the upper surface of the organic buffer layer enhance the bonding property of the substrate and the conductive film layer.
Description
technical field [0001] The invention belongs to the technical field of flexible electronics, and in particular relates to a flexible optoelectronic device. Background technique [0002] Flexible electronics can be summarized as an emerging electronic technology that manufactures organic / inorganic material electronic devices on flexible / ductile plastic or thin metal substrates. With its unique flexibility / extensibility and efficient, low-cost manufacturing processes, such as flexible electronic displays , printed RFID and electronic surface paste, etc., due to the rough surface of the conductive film layer, it is not conducive to bonding with the substrate, resulting in poor adhesion and affecting the performance of the device. Only relying on the substrate for single conduction, The conductivity is not good, and because there are no protection measures, the possibility of the device being vulnerable is increased, and the protection is poor. [0003] In order to solve the ab...
Claims
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IPC IPC(8): H01B5/14H01B5/00H01B1/12H01B1/04
CPCH01B5/14H01B1/04H01B1/12H01B5/002
Inventor 方铉刘思宁李含张强房丹
Owner 长春电子科技学院