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A semiconductor production device

A technology for production equipment and semiconductors, which is used in semiconductor/solid-state device manufacturing, fine working equipment, electrical components, etc. It can solve the problems of unstable pressing of semiconductors and low cutting quality of semiconductors, so as to improve cutting quality and improve cutting stability. , Improve the effect of clamping flexibility

Active Publication Date: 2021-12-10
江苏煜晶光电科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of the above situation, in order to overcome the defects of the prior art, the present invention provides a semiconductor production device, which effectively solves the problem that the semiconductor is shifted due to unstable pressing during the cutting process in the above background technology, resulting in low cutting quality of the semiconductor. question

Method used

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  • A semiconductor production device
  • A semiconductor production device
  • A semiconductor production device

Examples

Experimental program
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Effect test

Embodiment 1

[0034] Embodiment one, by Figure 1 to Figure 8Given, the present invention includes a base 1, the bottom of the base 1 is symmetrically provided with a support column 2, the top of the base 1 is provided with a support frame 3, the inner top of the support frame 3 is provided with a cutting mechanism 4, and the top of the base 1 is provided with a The support platform 5 below the cutting mechanism 4, the top middle position of the support platform 5 is provided with a mounting base 6, the top of the mounting base 6 is provided with an operating table 7, and the top of the operating table 7 is provided with a metal placement plate 8, through which the metal placement plate 8 The design is convenient for cutting the semiconductor placed on the top of the metal placement plate 8, and then can realize the protection of the console 7. The two sides of the mounting base 6 are symmetrically provided with a slide plate 12, and the bottom end of the slide plate 12 is equidistant from o...

Embodiment 2

[0037] Embodiment two, on the basis of embodiment one, by image 3 , Figure 4 with Figure 5 Given, one side of the support table 5 is provided with a mounting plate 19, and the slide plate 12 is provided with a groove 2 18 which is slidably connected with the mounting plate 19. By the design of the mounting plate 19 and the groove 2 18, it is convenient to make the slide plate 12 Sliding on the mounting plate 19 has effectively improved the stability of the movement of the slide plate 12. The middle position on both sides of the console 7 is provided with a groove-9 that is sleeved on the outside of the moving cylinder 13. Through the design of the groove-9, it is convenient The moving cylinder 13 is moved to both sides of the metal placing plate 8 to facilitate the clamping of the semiconductor on the top of the metal placing plate 8. The clamping rod 14 is a T-shaped structure, and the bottom end of the clamping rod 14 is in contact with the inner surface of the moving cy...

Embodiment 3

[0038] Embodiment three, on the basis of embodiment one, by figure 1 , figure 2 , Figure 5 , Image 6 with Figure 7 Given, the metal placement plate 8 is a concentric circle structure, the top of the console 7 is provided with a ventilation hole 30 located in the center of the metal placement plate 8, the interior of the support table 5 is provided with a receiving groove 31, and the interior of the mounting seat 6 is provided with a Accommodating groove 31 and vent hole 30 are communicated communication groove 32, and adsorption mechanism 16 comprises gear four 33, tooth plate 34, piston plate 35, stabilizer one 36, fixed rod 37 and movable groove 38, is connected on the rotating shaft two 22 The gear four 33 that is positioned at the interior of the accommodation groove 31 is movably connected with a piston plate 35 inside the communication groove 32, and the bottom end side of the piston plate 35 is provided with a tooth plate 34 meshingly connected with the gear four...

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Abstract

The invention relates to the field of semiconductor processing technology, and discloses a semiconductor production device, which solves the problem that semiconductors are shifted due to unstable pressing during the cutting process, resulting in low cutting quality of semiconductors. It includes a base, the base of which is The bottom end is symmetrically provided with a support column, the top of the base is provided with a support frame, the inner top of the support frame is provided with a cutting mechanism, the top of the base is provided with a support platform below the cutting mechanism, and the middle position of the top of the support platform is provided with a mounting seat. The top of the mounting seat is provided with an operation table, the top of the operation table is provided with a metal placement plate, the two sides of the mounting seat are symmetrically provided with slide plates, the bottom end of the slide plate is equidistantly provided with gear teeth, and the slide plates are provided with through grooves; The invention adopts clamping and fixing of semiconductors in different directions, improves the cutting stability of the semiconductors, can avoid the displacement phenomenon of the semiconductors during the cutting process, and further improves the cutting quality of the semiconductors.

Description

technical field [0001] The invention belongs to the technical field of semiconductor processing, in particular to a semiconductor production device. Background technique [0002] Semiconductors refer to materials whose conductivity is between that of conductors and insulators at room temperature. Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting applications, high-power power conversion and other fields, no matter from the perspective of technology or economic development. From the point of view, the importance of semiconductors is very huge. Most of today's electronic products, such as computers, mobile phones or digital recorders, are closely related to semiconductors. However, semiconductors usually require Cut it. [0003] Because it is difficult to fix the semiconductor during the cutting process of the current semiconductor, it is easy to cause the semiconductor to shift during cutting,...

Claims

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Application Information

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IPC IPC(8): H01L21/67B28D5/04B28D7/04B28D7/00
CPCB28D5/04B28D5/0094B28D5/0058H01L21/67092
Inventor 詹华贵
Owner 江苏煜晶光电科技有限公司
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