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A method for measuring ellipsometric spectrum under packaging conditions

A technology of ellipsometry spectroscopy and conditions, applied in the field of optical measurement, can solve the problems of complex integration of coating chamber and ellipsometer, difficult to avoid alkali metal oxidation, and high requirements for chamber vacuum.

Active Publication Date: 2022-06-21
NANJING UNIV
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Problems solved by technology

[0005] In-situ measurement of the dielectric function of alkali metals in a high-vacuum chamber, on the one hand, requires a high degree of vacuum in the chamber, on the other hand, it is very complicated to integrate the coating chamber and ellipsometer, and it is difficult to avoid the alkali metal Oxidation

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  • A method for measuring ellipsometric spectrum under packaging conditions
  • A method for measuring ellipsometric spectrum under packaging conditions

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Embodiment Construction

[0016] The technical solutions of the present invention will be described in detail below with reference to the accompanying drawings.

[0017] The trajectory of the test light passing through the encapsulation layer is as follows figure 1 As shown, measure the detector width δ, the beam diameter d, the imprecise refractive index n of the encapsulation layer, and the incident angle α, take the larger value of δ and d, max{d,δ}=w, by formula 1 Calculate the minimum encapsulation layer thickness.

[0018] Measure the ellipsometry spectrum on the upper surface of the encapsulation layer, and collect the ratio ρ of the p-polarization component to the s-polarization component of the reflected light from the ellipsometer, which is expressed by formula 2 Calculate the dielectric function εs of the encapsulation layer.

[0019] Calculate the refraction angle β of the package substrate by Equation 3 Calculate the parameter T of the package substrate.

[0020] By formula four C...

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Abstract

The invention discloses a method for measuring ellipsometric spectrum under packaging conditions, measuring detector width δ, beam diameter d, non-accurate refraction index n of packaging layer, incident angle α, taking the larger value max{d of δ and d ,δ}=w, calculate the minimum value of the thickness of the encapsulation layer; measure the ellipsometric spectrum on the upper surface of the encapsulation layer, collect the ratio ρ of the p-polarization component and the s-polarization component of the reflected light from the ellipsometer, and calculate the dielectric function εs of the encapsulation layer ; Measure the refraction angle β of the packaging substrate, calculate the air layer parameter T between the packaging substrate and the measured material and the dielectric function εm of the single-layer bulk material under packaging conditions. The invention does not need to know the dielectric properties of the packaging layer in advance, avoids the difficulty of multi-parameter fitting of the dielectric properties of the packaging layer, completely eliminates the error introduced by the packaging layer, and is suitable for different substrate packaging, vacuum box packaging, liquid Spectral ellipsometry testing under various packaging conditions such as phase packaging has certain universality.

Description

technical field [0001] The invention belongs to the technical field of optical measurement, in particular to an elliptical polarization spectrum measurement technology. Background technique [0002] The interaction between light and matter, especially the interaction mechanism and related measurement of photons and electrons, has been a scientific problem of physical optics for a long time. Surface plasmons generated by the interaction of photons and electrons at material interfaces have attracted attention due to their subwavelength properties and high energy localization. [0003] In recent years, with the improvement of material micro-nano processing and characterization capabilities, metal surface plasmontics have shown broad application prospects in the fields of spectroscopy, metasurfaces, and photocatalysis. Due to the high locality of the electromagnetic field, the metal surface plasmon also exhibits the characteristics of high ohmic loss, making it difficult to be ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01N21/21
CPCG01N21/211
Inventor 周林傅涵堉陈舒颖陈鑫杰朱嘉
Owner NANJING UNIV
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