Organic-inorganic hybrid cross-linked heat-conducting silica gel and preparation method thereof

A heat-conducting silica gel, hybrid cross-linking technology, applied in the field of heat-conducting materials, can solve the problem of low thermal conductivity of the system as a whole, and achieve the effects of excellent thermal conductivity, good mechanical properties, and suitable operating viscosity

Pending Publication Date: 2021-11-19
SHANDONG IND TECH RES INST OF ZHEJIANG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Generally, thermally conductive fillers are dispersed in the matrix by mechanical blending. This purely physical dispersion method will cause the overall thermal conductivity of the system to be low, and there will be obvious settlement over time.

Method used

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  • Organic-inorganic hybrid cross-linked heat-conducting silica gel and preparation method thereof
  • Organic-inorganic hybrid cross-linked heat-conducting silica gel and preparation method thereof
  • Organic-inorganic hybrid cross-linked heat-conducting silica gel and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] The mass proportion of each component in this example is: vinyl silicone oil 29.7%, hydrogen-containing silicone oil 5.4%, dimethyl silicone oil 4.34%, chemically modified inorganic thermally conductive filler 41.59%, copper powder 17.82%, white carbon black 0.96% %, graphene 0.15%, catalyst 0.03%, inhibitor 0.0075%, wherein the inorganic filler to be modified adopts alumina, and the mass ratio of the coupling agent to the inorganic filler to be modified is 0.02:1.

[0043] The organic-inorganic hybrid cross-linked thermally conductive silica gel is prepared by using the components listed above in terms of mass proportion, and the specific steps are as follows:

[0044] S1a. Weigh 80g of deionized water into an Erlenmeyer flask, place it in a constant temperature water bath for stirring, add 2.4g of KH570 dropwise to it, heat and stir it in a constant temperature water bath at 60°C for 2 hours after adding it completely, and then gradually add 120g of alumina to be modi...

Embodiment 2

[0048] The mass proportion of each component in this example is: vinyl silicone oil 29.7%, hydrogen-containing silicone oil 5.4%, dimethyl silicone oil 4.34%, chemically modified inorganic thermally conductive filler 41.59%, copper powder 17.82%, white carbon black 0.96% %, graphene 0.15%, catalyst 0.03%, and inhibitor 0.0075%, wherein the inorganic filler to be modified is alumina, and the mass ratio of the coupling agent to the inorganic filler to be modified is 0.05:1.

[0049] The organic-inorganic hybrid cross-linked thermally conductive silica gel is prepared by using the components listed above in terms of mass proportion, and the specific steps are as follows:

[0050] S1a. Weigh 80g of deionized water into an Erlenmeyer flask, place it in a constant temperature water bath for stirring, add 2.4g of KH570 dropwise to it, heat and stir it in a constant temperature water bath at 60°C for 2 hours after adding it completely, and then gradually add 48g of alumina to be modif...

Embodiment 3

[0054] The mass proportion of each component in this example is: vinyl silicone oil 29.7%, hydrogen-containing silicone oil 5.4%, dimethyl silicone oil 4.34%, chemically modified inorganic thermally conductive filler 41.59%, copper powder 17.82%, white carbon black 0.96% %, graphene 0.15%, catalyst 0.03%, inhibitor 0.0075%, wherein the inorganic filler to be modified adopts alumina, and the mass ratio of the coupling agent to the inorganic filler to be modified is 0.035:1.

[0055] The organic-inorganic hybrid cross-linked thermally conductive silica gel is prepared by using the components listed above in terms of mass proportion, and the specific steps are as follows:

[0056] S1a. Weigh 80g of deionized water into an Erlenmeyer flask, place it in a constant temperature water bath for stirring, add 2.4g of KH570 dropwise to it, heat and stir it in a constant temperature water bath at 60°C for 2 hours after adding it completely, and then gradually add 68.57g of alumina to be m...

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Abstract

The invention discloses organic-inorganic hybrid cross-linked heat-conducting silica gel, which is prepared from the following raw materials: vinyl silicone oil, hydrogen-containing silicone oil, dimethyl silicone oil, chemically modified inorganic filler, copper powder, white carbon black, graphene, a catalyst and an inhibitor. The organic-inorganic hybrid cross-linked heat-conducting silica gel comprises the following components in percentage by weight: 30%-35% of vinyl silicone oil, 5%-8% of hydrogen-containing silicone oil, 2%-5% of dimethyl silicone oil, 35%-40% of chemically modified inorganic filler, 15%-20% of copper powder, 1%-5% of white carbon black, 0.1%-0.3% of graphene, 0.02%-0.06% of a catalyst and 0.005%-0.01% of an inhibitor, wherein the chemically modified inorganic filler is obtained by modifying a to-be-modified inorganic filler with a coupling agent. The to-be-modified inorganic filler is modified through the coupling agent, the surface of the to-be-modified inorganic filler is modified to enable the to-be-modified inorganic filler to have double-bond functional groups the same as those of a matrix, the filler and the matrix are connected together in a chemical bond mode through the hydrosilylation effect, through connection of the chemical formula, sedimentation of the filler can be effectively improved, and the construction of a whole heat-conducting passage of the system is facilitated.

Description

technical field [0001] The invention belongs to the technical field of heat-conducting materials, in particular to an organic-inorganic hybrid cross-linked heat-conducting silica gel. Background technique [0002] As the integration of electronic products is getting higher and higher, the heat generated by the products is becoming more and more concentrated. How to quickly and effectively export the heat is the key to restricting the further development of the products. Traditional silicone grease and silica gel can no longer meet their needs due to high viscosity and low thermal conductivity, and due to the high volatility and low stability of silicone grease, the stability of the product is affected. Thermally conductive silicone is in line with the needs of the times. [0003] Thermally conductive silica gel is mainly composed of curable matrix and thermally conductive filler. According to the needs of use, select the appropriate matrix and filler to compound through a c...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/07C08L83/05C08L83/04C08K9/06C08K3/08C08K7/26C08K3/04C08K3/22C08K3/28
CPCC08L83/04C08K2003/085C08K2003/2227C08K2003/2296C08K2003/282C08K9/06C08K3/08C08K7/26C08K3/042C08K3/22C08K3/28
Inventor 陈威曹衍龙金蕊
Owner SHANDONG IND TECH RES INST OF ZHEJIANG UNIV
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