Capacitance loading type miniaturized 5G filter based on multi-layer PCB structure

Abstract

The invention provides a capacitance loading type miniaturized 5G filter based on a multi-layer PCB structure. The filter comprises a quarter-wavelength uniform impedance resonator, and two parallel plates are loaded on the two sides of the opening end of the quarter-wavelength uniform impedance resonator respectively. A plate capacitor is formed between each of the two parallel plates and the quarter-wavelength uniform impedance resonator; the quarter-wavelength uniform impedance resonator and the two parallel plates are respectively supported by a dielectric substrate; the filter further comprises a top-layer metal floor arranged on the topmost layer of the filter and a bottom-layer metal floor arranged on the bottommost layer of the filter, and the top-layer metal floor is supported by a dielectric substrate; and a semi-cured bonding layer is arranged between the adjacent dielectric substrates for bonding. By loading the capacitor, the resonant frequency is reduced, miniaturization is achieved, the low conductor loss is achieved, the Q value of the resonator is improved, the advantage of low loss is achieved, the space in the stacking direction is fully utilized, and miniaturization is further achieved.

Description

technical field [0001] The invention relates to the technical field of filters, in particular to a capacitor-loaded miniaturized 5G filter based on a multilayer PCB structure. Background technique [0002] As an indispensable and important device in radio frequency circuits and wireless communication systems, filters determine the performance and quality of the entire microwave system. With the comprehensive advancement of communication technology represented by 5G, there is an urgent need for miniaturized and high-performance bandpass filters in the N79 frequency band (4400MHz~5000MHz) under 5G communication. [0003] At present, the commonly used miniaturized bandpass filters can be roughly divided into non-full-mode substrate integrated waveguide (SIW) bandpass filters, split-ring resonator (SRR) filters, and lumped capacitors ( or inductance) to load the filter. [0004] As far as the current non-full-mode substrate-integrated waveguide (SIW) bandpass filter is concern...

AI Technical Summary

Problems solved by technology

[0004] As far as the current non-full-mode substrate-integrated waveguide (SIW) bandpass filter is concerned, the substrate-integrated waveguide is cut symmetrically (or diagonally) along the center into half-mode (or quarter-mode, one-eighth mode) ) resonator, although the volume of the resonator is reduced, the closed structure of the cavity is destroyed at the same time, the radiation loss is increased, the Q value is reduced, and there are disadvantages such as large loss

[0005] As far as the current split-ring resonator (SRR) filter is concerned, since the size of the split-ring resonator is one-half wavelength, the volume occupied is twice that of a quarter-wavelength short-circuit resonator, and there are limited miniaturization effects, etc. shortcoming

[0006] As far as the current lumped capacitance (or inductance) load filter is concerned, due to the limitation of the distributed parameters of the lumped element capacitance and inductance at high frequencies, the capacitance value and inductance value cannot maintain the nominal value and are difficult to control. There are disadvantages such as lumped capacitor (or inductance) loaded filter is not easy to be designed at high frequency; in addition, the introduction of lumped components will also bring additional conductor loss, and there are disadvantages such as large filter loss

[0007] To sum up, the current miniaturized bandpass filter has disadvantages such as large loss, limited miniaturization effect, and difficult to be designed.

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