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Microwave product thermal simulation method based on soldering tin thermal conductivity test

A technology of thermal conductivity and thermal simulation, applied in the field of measurement and testing, to achieve the effect of easy to find test equipment, ensure accuracy, and accurately evaluate heat dissipation

Active Publication Date: 2021-11-30
BEIJING RES INST OF TELEMETRY +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] In order to solve the problem of the accuracy of thermal simulation results, the present invention provides a thermal simulation method for microwave products based on solder thermal conductivity testing. This method accurately calculates the thermal conductivity of different types of solder through testing, and the accuracy of the test values ​​makes it possible to The simulation results of product thermal simulation with this parameter are more reliable, especially in the case of using different types of solder sheets in the micro-assembly process of microwave products, it can reliably predict the temperature rise during the working process of microwave products, and finally effectively ensure the microwave The service life of components in the product further improves the practical guiding significance of product thermal simulation for product reliability

Method used

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  • Microwave product thermal simulation method based on soldering tin thermal conductivity test
  • Microwave product thermal simulation method based on soldering tin thermal conductivity test
  • Microwave product thermal simulation method based on soldering tin thermal conductivity test

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Embodiment 1

[0044] Such as figure 1 As shown, a thermal simulation method for microwave products based on solder thermal conductivity test includes the following steps:

[0045] S1. Solder thermal conductivity test: connect the microwave product 1 to be tested with the solder thermal conductivity test device, obtain the test result after the microwave product 1 to be tested enters a stable state, and calculate the thermal conductivity λ of the solder;

[0046] S2. Thermal simulation: Add the thermal conductivity λ to the solder material parameter setting of the simulation software and create a new solder material, set the simulation boundary conditions, and finally obtain the thermal simulation results of the microwave product 1 to be tested, and use the thermal simulation results to test The thermal performance of microwave products 1 was evaluated and optimized.

Embodiment 2

[0048] Such as figure 1 As shown, a thermal simulation method for microwave products based on solder thermal conductivity test includes the following steps:

[0049] S1. Solder thermal conductivity test: connect the microwave product 1 to be tested with the solder thermal conductivity test device, obtain the test result after the microwave product 1 to be tested enters a stable state, and calculate the thermal conductivity λ of the solder;

[0050] Such as Figure 2-6As shown, S11, device connection: fix the first temperature sensor 2 on the upper surface of the chip 11, fix the second temperature sensor 3 on the inner surface of the box body 12, connect the first temperature sensor 2, the second temperature sensor 3 and the multi-functional The switch controller 4 is connected, the microwave product 1 to be tested is placed on the liquid cooling test frame 5 and the microwave product 1 to be tested is connected to the power meter 6 and the power supply 7 respectively;

[00...

Embodiment 3

[0060] Such as Figure 1-2 As shown, a thermal simulation method for microwave products based on solder thermal conductivity test,

[0061] (1) Prepare the following related test equipment and products to be tested: liquid cooling test rack (provide a cold plate with a constant temperature for the installation surface of the product to be tested), power supply (to supply power to the product to be tested), power meter (to monitor the working stability of the product) , thermocouple wire (temperature sensor), plus wire (connecting the power supply and the product under test), multi-function switch controller (reading temperature), and the product under test.

[0062] (2) Press Image 6 The connection relationship shown in the figure interconnects the test equipment with the product under test. Figure 5 Shown is the internal structure of the product to be tested, including three parts: the product box, the solder layer and the chip. according to Figure 3-4 As shown, two te...

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Abstract

The invention provides a microwave product thermal simulation method based on soldering tin thermal conductivity test, which comprises the following steps of firstly, testing the thermal conductivity of soldering tin, fixing temperature sensors on the upper surface of a chip of a to-be-tested product and the inner surface of a box body, placing the to-be-tested product on a liquid cooling test frame, and respectively connecting the to-be-tested product with a power meter and a power supply, and when the to-be-tested product reaches a thermal stable state, according to the temperature value and the power of the temperature sensor, calculating to obtain the thermal conductivity of the soldering tin layer, and then performing thermal simulation. According to the method, the simulation result of product thermal simulation based on the thermal conductivity of the soldering tin is more reliable, the thermal conductivity of different types of soldering tin is accurately calculated through testing, the accuracy of the thermal simulation result of a microwave product assembly is effectively improved, and especially under the condition that different types of soldering flux pieces are used in the microwave product micro-assembly process, the temperature rise in the working process of the microwave product is reliably pre-judged, the service life of components in the microwave product is effectively guaranteed finally, and the practical guiding significance of thermal simulation of the product on the use reliability of the product is further improved.

Description

technical field [0001] The invention relates to the technical field of measurement and testing, in particular to a thermal simulation method for microwave products based on solder thermal conductivity testing. Background technique [0002] With the development of microwave component product technology, the requirements for various indicators of microwave components are constantly improving, and the components inside the components are constantly developing in the direction of miniaturization and high power consumption. The improvement of system integration will inevitably lead to a sharp increase in the internal heat flux of the product. The temperature rise generated during the use of the product will affect the service life of bare chips and other devices. Therefore, thermal simulation technology is used to predict the thermal performance of the product And analysis will greatly improve the reliability of the product in use. [0003] As an important parameter affecting th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N25/20
CPCG01N25/20Y02D10/00
Inventor 王丽菊刘德喜史磊贾建鹏高倩唐统帅管浩东
Owner BEIJING RES INST OF TELEMETRY