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Core material, electronic component, and method for forming bump electrode

A technology of electronic components and core materials, applied in the field of core materials, to achieve the effect of preventing the thickness from being too thick

Active Publication Date: 2021-12-07
SENJU METAL IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As such, the Cu core ball having a solder plating layer composed of a Sn-based solder alloy composed of Sn and Bi will cause the above-mentioned defects when there is a concentration gradient of Bi in the solder plating layer.

Method used

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  • Core material, electronic component, and method for forming bump electrode
  • Core material, electronic component, and method for forming bump electrode
  • Core material, electronic component, and method for forming bump electrode

Examples

Experimental program
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Effect test

Embodiment

[0120] Hereinafter, the present embodiment will be described in detail with reference to examples and comparative examples. In addition, this embodiment is not limited to these Examples. In each of Examples 1-27 and Comparative Examples 1-27 described later, the Bi concentration in the solder plating layer is set as follows: Concentration ratio (%)=average value (mass %) of measured values ​​of Bi / target Bi content (mass%) is 90% to 108.6%.

[0121] The evaluation of the degree of yellowness and the evaluation of defects at the time of joining were performed according to the following criteria, as evaluations of the core balls composed of the compositions shown in the tables below.

[0122]

[0123] The yellowness of the core ball was measured using a CM-2600d spectrophotometer manufactured by Konica Minolta Corporation. When the degree of yellowness in the L*a*b* color system is 8.5 or less, it is set as "good" and marked with "○" in each table, and when the degree of yel...

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Abstract

A core material has a core 12; a solder layer (16) of a (Sn-Bi)-based solder alloy provided on the outside of the core (12); and a Sn layer (20) provided on the outside of the solder layer (16). The core contains a metal or a resin, and the concentration ratio of Bi contained in the solder layer (16) is 91.4-106.7% when the concentration ratio (%) = measured value (mass%) of Bi / target Bi content (mass%), or the concentration ratio (%) = average value (mass%) of measured values of Bi / target Bi content (mass%). The thickness of the Sn layer (20) is 0.215% or more and 36% or less of the thickness of the solder layer (16).

Description

technical field [0001] The present embodiment relates to a core material, an electronic component having a solder bump using the core material, and a method for forming a bump electrode. [0002] This application claims priority to Japanese Patent Application No. 2019-194731 filed on October 25, 2019, and the entire contents thereof are incorporated by reference. Background technique [0003] In recent years, along with the development of small information equipment, the electronic components mounted on it are rapidly miniaturized. Electronic components use a Ball Grid Array (BGA) structure in which electrodes are arranged on the back side in response to the reduction in the size of the connection terminals and the reduction in the mounting area in order to meet the demand for miniaturization. [0004] Electronic components to which BGA is applied include, for example, semiconductor packages. The semiconductor package is constituted by resin-sealing a semiconductor chip ha...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/488H01L21/48B23K35/26C22C12/00C22C13/02C23C2/08C23C2/34C23C28/02C25D3/30C25D3/60C25D7/00C25D21/12
CPCH01L23/488H01L21/4814C23C28/021C23C28/023C22C12/00C22C13/02C25D3/60C25D21/12C25D7/00C23C2/08C23C2/34C25D3/30B23K35/26B23K35/262B23K35/264B23K35/0244H05K3/3478H05K3/3436H05K2201/10734H05K2203/041H05K2201/10234H05K2201/0338B32B15/01C22C13/00C23C30/00H05K3/34B22F1/17B23K2103/08
Inventor 近藤茂喜土屋政人须藤皓纪冈田弘史相马大辅
Owner SENJU METAL IND CO LTD