Manufacturing method of upper sealing head of high-level liquid waste glass curing container
A technology of glass solidification and high-level waste liquid, which is applied to household appliances, hollow objects, other household appliances, etc., can solve the problems of over-tolerance, large metal drawing deformation, and thinning of cracked wall thickness, so as to reduce cutting The effect of reducing the amount of waste, the amount of metal drawing deformation is small, and the amount of waste is reduced.
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
Embodiment 1
[0066] This embodiment provides a method for manufacturing the upper head of the vitrification container of high-level radioactive waste liquid, such as Figure 3-15 , comprising step one of forming a preset blank mold 3 with a preset neck 33, said step one comprising:
[0067] S1. Cold stamping the steel plate to form a blank mold 1, the lower part of the blank mold 2 is a cylindrical part 21, and the upper part of the blank mold 2 is a raised part;
[0068] S2. Cold stamping the raised portion of the blank mold one 2, so that the blank mold one 2 forms the preset blank mold 3 having a preset shoulder 32 and a preset neck 33, and the preset neck The height of 33 is greater than the height of the highest point of the protrusion, the height of the preset neck 33 is 105-108 mm, and the outer diameter of the preset neck 33 is 149.5-150.3 mm.
[0069] In this scheme, after the steel plate is formed into the preset blank mold 3 with the preset neck 33 by cold stamping, the upper a...
PUM
Property | Measurement | Unit |
---|---|---|
diameter | aaaaa | aaaaa |
diameter | aaaaa | aaaaa |
diameter | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com