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Sintered graphene foam block reinforced graphene heat-conducting gasket and preparation method thereof

A technology of graphene foam and thermal pads, applied in chemical instruments and methods, lamination devices, lamination, etc., can solve problems such as poor thermal conductivity of adhesives, affecting thermal conductivity of composite materials, and reducing thermal conductivity of composite materials , to achieve the effect of high thermal conductivity in the thickness direction

Pending Publication Date: 2021-12-10
CHANGZHOU FUXI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The graphene thermal pads prepared by the above two methods all use an adhesive to make the graphene sheets bond together to form a graphene / adhesive composite material, and the thermal conductivity of the adhesive itself is very poor, less than The thermal conductivity of 0.5W / (m K) has seriously affected the thermal conductivity of the composite material, so that the thermal conductivity of the prepared graphene / adhesive composite material is mostly not more than 50W / (m K), even if it is processed The very good composite material, the thermal conductivity does not exceed 100W / (m K), the introduction of the adhesive seriously reduces the thermal conductivity of the composite material

Method used

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  • Sintered graphene foam block reinforced graphene heat-conducting gasket and preparation method thereof
  • Sintered graphene foam block reinforced graphene heat-conducting gasket and preparation method thereof
  • Sintered graphene foam block reinforced graphene heat-conducting gasket and preparation method thereof

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preparation example Construction

[0044] figure 1 It is a schematic diagram of the flow chart of the preparation method of the graphene thermal pad reinforced by sintered graphene foam block of the present invention, as figure 1 Shown, described preparation method comprises:

[0045] Step S1, preparing a single graphene carbide film;

[0046] Step S2, preparing highly oriented graphene foam blocks, such as figure 2 , 3 and 5, from figure 2 and 5 It can be seen that the multiple graphene carbonized films of the graphene foam block are neatly stacked layer by layer along the horizontal direction (x-y plane) on the microstructure. From the vertical section (z direction), it presents a book-like neat structure. There is no disordered graphene carbonized film such as tilting or vertical, and the graphene foam block is a highly oriented graphene foam block, and the heat of the highly oriented graphene foam block can be efficiently conducted along the horizontal direction (x-y plane), without Due to the irreg...

Embodiment 1

[0067] A single 100 μm graphene oxide film was placed between two pieces of carbon paper, and then the whole was placed in a high-temperature furnace for high-temperature carbonization. The high-temperature carbonization temperature was 1000°C, the heating rate was 2°C / min, and the internal pressure of the high-temperature furnace was 10Pa. After high-temperature carbonization, a single 120 μm graphene carbide film was prepared. 833 graphene carbonized films are stacked into blocks, and then the stacked blocks are placed between two sheets of carbon paper, and then a graphite plate is placed on top to increase the pressure. The pressure is controlled at 5MPa, and then the whole is placed in a high-temperature furnace for high-temperature graphitization , the high-temperature graphitization temperature is 3000°C, the heating rate is 3°C / min, and the atmosphere of the high-temperature furnace is inert gas. After graphitization at high temperature, a 100 mm thick graphene foam bl...

Embodiment 2

[0069] A single 200 μm graphene oxide film was placed between two pieces of carbon paper, and then the whole was placed in a high-temperature furnace for high-temperature carbonization. The high-temperature carbonization temperature was 1000°C, the heating rate was 2°C / min, and the internal pressure of the high-temperature furnace was 10Pa. After high-temperature carbonization, a single 300 μm graphene carbide film was prepared. Stack 334 graphene carbonized films into blocks, then place the stacked blocks between two sheets of carbon paper, and then place a graphite plate on top to increase the pressure, control the pressure to 5MPa, and then place the whole in a high-temperature furnace for high-temperature graphitization , the high-temperature graphitization temperature is 3000°C, the heating rate is 3°C / min, and the atmosphere of the high-temperature furnace is inert gas. After graphitization at high temperature, a 100 mm thick graphene foam block is prepared. The obtaine...

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Abstract

The invention provides a preparation method of a sintered graphene foam block reinforced graphene heat-conducting gasket. The preparation method comprises the following steps: preparing graphene carbonized films; stacking the graphene carbonized films, and sintering to prepare a highly oriented graphene foam block; and slicing the graphene foam block in the longitudinal direction to obtain the graphene heat conduction gasket, wherein the longitudinal direction is the stacking direction of the multiple graphene carbonized films. The invention also provides the graphene heat-conducting gasket. The sintered graphene foam block reinforced graphene heat-conducting gasket is free of adhesive compounding, and has the advantages of low density and high thermal conductivity in the thickness direction.

Description

technical field [0001] The invention belongs to the technical field of heat conduction pads, in particular to a graphene heat conduction pad reinforced by sintered graphene foam blocks and a preparation method thereof. Background technique [0002] Graphene thermal pad is a high-performance gap-filling thermal conductivity material, which can reduce the thermal resistance of the interface. Compared with traditional gap-filling thermal conductivity materials, graphene thermal pad has higher thermal conductivity and lower Applied thermal resistance and other advantages. Graphene thermal pads are mainly used for interface heat transfer of high-power electronic equipment. At present, there are two main ways to prepare graphene thermal pads by using graphene: one is to stack and bond the graphene thermal film / foam film into blocks through adhesives, and then cut them into thermal pads along the longitudinal direction, so that The graphene heat-conducting film / foam film is arran...

Claims

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Application Information

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IPC IPC(8): B32B9/00B32B9/04B32B37/06C04B35/52C04B35/645
CPCB32B9/007B32B9/046B32B5/18B32B5/32B32B37/06C04B35/522C04B35/645B32B2307/302B32B2307/72B32B2266/04C04B2235/6562
Inventor 李峰葛翔石燕军李壮卢静周步存
Owner CHANGZHOU FUXI TECH CO LTD
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