Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Semiconductor device test equipment

A test equipment and semiconductor technology, applied in the direction of single semiconductor device testing, instruments, measuring electricity, etc., can solve the problems of moisture condensation, condensation, affecting semiconductor device testing and aging, etc., to reduce the content, reduce nitrogen loss, maintain Effect of dry gas atmosphere

Pending Publication Date: 2021-12-14
王华江
View PDF0 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] When conducting low-temperature product testing, when semiconductor devices are placed in a low-temperature environment, if the test environment contains water vapor, the water vapor will easily condense on the surface of the semiconductor, causing condensation and affecting the testing and aging of semiconductor devices

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Semiconductor device test equipment
  • Semiconductor device test equipment
  • Semiconductor device test equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0044] see Figure 1-2 and Figure 4, a semiconductor device testing equipment, comprising a test box 1, the upper end of the test box 1 is fixedly connected with a controller 2, the right end of the test box 1 is fixedly connected with a hydraulic cylinder 11, and the output end of the hydraulic cylinder 11 penetrates the test box from outside to inside The outer end of 1 is fixedly connected with a test head 12, and the position of the test head 12 is controlled by a hydraulic cylinder 11 to make contact with the semiconductor device for detection. The inner wall of the test box 1 is fixedly connected with a refrigerator 10, a refrigerator 10, and a hydraulic cylinder 11 and the test head 12 are electrically connected with the controller 2. The refrigerator 10 is used to refrigerate the gas in the test box 1 to make it reach a low temperature test temperature. The outer end of the test box 1 is fixedly connected to the inside of the test box 1. The air inlet pipe and air ou...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses semiconductor device testing equipment, and belongs to the technical field of semiconductor testing, an inner rotating column is used as a carrier for accommodating and transmitting a semiconductor device, the import, detection and export processes of the semiconductor device in a testing box can be realized without opening the testing box, and the dry gas atmosphere in the testing box is effectively maintained. In the synchronous leading-in and leading-out process of the semiconductor device, pre-dehumidification and temperature returning ventilation are sequentially carried out on the area where the semiconductor device is located, nitrogen loss is effectively reduced, meanwhile, the content of air moisture entering the test box is greatly reduced, and the dry gas atmosphere is further effectively maintained for a long time. In addition, the detected semiconductor device is not easy to condense when being taken out.

Description

technical field [0001] The invention relates to the technical field of semiconductor testing, and more specifically, to a semiconductor device testing equipment. Background technique [0002] A semiconductor device is an electronic device whose conductivity is between a good conductor and an insulator. It uses the special electrical properties of semiconductor materials to complete specific functions. It can be used to generate, control, receive, transform, amplify signals and perform energy conversion. [0003] In the research and development process of each semiconductor device, in order to ensure that the semiconductor device can work normally in high temperature and low temperature environments, it is often necessary to conduct low temperature and high temperature tests on the finished semiconductor devices to select qualified products and circulate them in the market. [0004] When conducting low-temperature product testing, when semiconductor devices are placed in a lo...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/26
CPCG01R31/2601
Inventor 王华江
Owner 王华江
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products