The invention discloses a multi-channel
temperature control device used for
semiconductor coating equipment, and belongs to the field of
temperature control. According to the multi-channel temperaturecontrol device used for the
semiconductor coating equipment, through the arrangement of a
temperature control laminated channel layer and a selective
heat conducting rod, when the temperature needs to be increased,
heat conducting gas runs from bottom to top, an air blowing layer is attached to a fixed multi-channel plate, at the moment, part of the holes in the air blowing layer are blocked, theheat conduction gas enters the upper part of the temperature control device, the speed of the heat conduction gas to make contact with a
semiconductor is decreased, and therefore the overall temperature rising speed of the temperature control device can be effectively controlled, the phenomenon that a film fails due to too high temperature rising of the semiconductor is avoided, and the success rate of semiconductor
coating is effectively increased; and when the temperature needs to be decreased, the heat conduction gas moves downwards, so that the air blowing layer is bulged downwards untilthe air blowing layer is punctured by the selective
heat conducting rod, and the heat conduction gas is directly contacted with the selective heat conducting rod to transfer heat downwards, so that the
cooling speed is remarkably increased, the
cooling time is shortened, and the semiconductor coating efficiency in the same time is effectively improved.