VCSEL chip cylindrical surface etching method based on self-alignment technology, and application thereof

Abstract

The invention discloses a VCSEL chip cylindrical surface etching method based on a self-alignment technology, and application thereof. The VCSEL chip cylindrical surface etching method comprises the steps that an N contact layer, an NDBR layer, an active layer, an oxide layer, a PDBR layer and a P contact layer are formed on a substrate layer by layer, and a metal circular ring is formed on the P contact layer; and an area outside the outer edge of the metal circular ring is etched to make a cylindrical surface etched below the metal circular ring and the oxide layer exposed. The metal circular ring is used as a hard mask layer in etching, a central mask layer is used for shielding the hollow position of the metal circular ring, and the edge of the central mask layer is located between the outer edge and the inner edge of the metal circular ring. The method is simple in process and convenient to implement, the self-alignment technology is adopted, the center of the mask layer does not need to directly face the center of the circular ring, dependence on the alignment precision is reduced, the quality and the yield of the VCSEL chip can be greatly improved, and the risk of oxidation hole deviation caused by the photoetching alignment precision problem is effectively overcome.

Description

technical field [0001] The invention belongs to the field of chips, and in particular relates to a method for etching a cylindrical surface of a VCSEL chip based on a self-alignment technology and an application thereof. Background technique [0002] At present, the VCSEL device technology needs to use photoresist as a mask in the cylinder etching process, and use a dry etching method to etch a circular cylinder. However, due to a certain overlay accuracy problem in the photolithography process, there will be a problem that the center position of the circular mask pattern deviates from the center of the metal ring after the cylinder lithography is developed. In turn, after the subsequent oxidation process is completed, the center of the oxidation hole deviates from the center of the metal ring, causing the metal ring to block the laser beam, resulting in a drop in laser power and distortion in the shape of the spot. Contents of the invention [0003] The present invention...

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Problems solved by technology

In turn, after the subsequent oxidation process is completed, the center of the oxidation hole deviates from the center of the metal ring, causing the metal ring to block the laser beam, causing the laser power to drop and the shape of the spot to be distorted

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