Method for manufacturing electronic component cooling device comprising heat pipe and heat transfer block
A technology for cooling devices and electronic devices, applied in semiconductor/solid-state device manufacturing, electrical solid-state devices, chemical instruments and methods, etc., can solve problems such as low heat dissipation performance, lossy conductivity, poor heat dissipation effect, etc., and achieve enhanced adsorption performance , prevent flow, prevent the effect of sintering phenomenon
Active Publication Date: 2021-12-14
ZALMAN TECH CO LTD
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[0014] However, according to the process as described above, the generated powder is trapped between the heat pipe 140 and the first plate, and is sintered by the heat provided when it is press-molded after pressing or while pressing, so that when heat transfer When the block 150 and the heat pipe 140 are integrated, the original purpose of the heat dissipation effect generated by the difference in conductivity obtained by forming the heat transfer block 1500 and the heat pipe 140 by different materials will be impaired, so there is a heat dissipation effect. Issues with lower performance than initially expected
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[0035] The best mode of carrying out the present invention is as follows. A method of manufacturing an electronic device cooling device comprising a cooling tower in which a plurality of heat dissipation plates are stacked at predetermined intervals in the height direction, and a copper plate extending in the height direction through one side of the heat dissipation plate. In the state of the heat pipe made of different materials, the heat transfer block covered with the cover after the heat pipe is accommodated in the base with the groove is located on the upper surface of the electronic device, and the manufacturing method of the electronic device cooling device includes: making the A first step of pressing the base against the heat pipe by a press in a state where the base is located on the heat pipe so that the groove accommodates the heat pipe; a second step of dropping copper powder that occurs during the pressing process; and a third step of realigning the combined body...
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A method for manufacturing an electronic component cooling device comprising a heat pipe and a heat transfer block according to the present invention is characterized by comprising: a first step of pressing a base to a heat pipe such that a groove receives the heat pipe through a press while the base is positioned on the heat pipe; a second step of dropping copper powder generated in the pressing process; a third step of rearranging a combined body of the base and the heat pipe such that the base is positioned below; and a fourth step of pressing a cover to the combined body through a press while the cover is positioned on the combined body.
Description
technical field [0001] The present invention relates to a manufacturing method of an electronic device cooling device including a heat pipe and a heat transfer block. A method for manufacturing an electronic device cooling device that has the problem of a decrease in heat dissipation efficiency due to sintering that occurs when a heat transfer block and a heat pipe are combined. Background technique [0002] In general, a semiconductor integrated circuit refers to an ultra-small circuit composed of multiple circuit elements such as transistors or diodes and various resistors or capacitors in an inseparable form on a single substrate. Recently, it is not only used in computers and terminal equipment, It is also widely used in devices of various electronic equipment such as control and metering equipment including TV, audio equipment, and electronic communication equipment, and the integration rate is also in the trend of being produced at a high density. [0003] Therefore, ...
Claims
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IPC IPC(8): H01L23/427H01L23/367H01L23/373H05K7/20C09K5/10B01J20/20B01J20/30H01L23/40
CPCH01L23/427H01L21/4882H01L23/3672H01L23/3675H01L23/373H05K7/20336C09K5/10B01J20/20B01J20/3078B01J20/3071H01L2023/4037B23P15/26B23P2700/09
Inventor 尹国领
Owner ZALMAN TECH CO LTD