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Array substrate and preparation method thereof

A technology for array substrates and substrate substrates, applied in the field of array substrates and their preparation, can solve problems such as difficulty in accurately controlling the uniformity of metal lead shape thickness, unfavorable uniformity of product characteristics, and limited applicability, and achieve improved thickness, Excellent surface uniformity and improved thickness uniformity

Pending Publication Date: 2021-12-17
BOE TECH GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, this method is only suitable for directly preparing thick copper metal leads on the substrate, which has great limitations in applicability, and it is difficult to accurately control the morphology and thickness uniformity of the prepared metal leads, which is not conducive to Uniformity of product characteristics

Method used

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  • Array substrate and preparation method thereof
  • Array substrate and preparation method thereof
  • Array substrate and preparation method thereof

Examples

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Embodiment Construction

[0097] Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. The described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are provided in order to give a thorough understanding of embodiments of the present disclosure.

[0098] In the drawings, the thicknesses of regions and layers may be exaggerated for clarity. The same reference numerals in the drawings denote the same or similar structures, and thus their detailed descriptions will be omitted.

[0099] The described features, structures, or characteristic...

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PUM

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Abstract

The invention provides an array substrate and a preparation method thereof, and belongs to the technical field of display. The preparation method of the array substrate comprises the following steps: sequentially forming a substrate, a driving circuit layer and a functional device layer which are stacked, wherein the step of forming the driving circuit layer comprises the substeps: forming conductive seeds on one side of the substrate; forming a removable pattern limiting layer on the surface of the conductive seed layer, wherein the removable pattern limiting layer is provided with a lead opening, and the lead opening exposes part of the conductive seed layer; forming an electroplating metal layer positioned on the surface of the conductive seed layer in the lead opening by adopting an electroplating process; removing the removable pattern limiting layer; and removing the part, which is not covered by the electroplated metal layer, of the conductive seed layer to form a first lead layer. According to the preparation method, the electroplating process is suitable for any metal wiring layer, and the morphology of the first lead layer is improved.

Description

technical field [0001] The present disclosure relates to the field of display technology, in particular to an array substrate and a preparation method thereof. Background technique [0002] For medium and large-sized self-illuminating panels, such as medium and large-sized Micro LED display panels, medium and large-sized Mini LED backlights or display panels, the long distance of metal leads leads to serious voltage drop on the metal leads, which is difficult to guarantee Sufficient driving current is provided for each current-driven light emitting device. In the prior art, the seed lead can be formed on the base substrate first, and then a copper growth layer is formed on the seed lead by using a copper electroplating process, so as to prepare a metal lead with a relatively large thickness and reduce the voltage drop on the metal lead. However, this method is only suitable for directly preparing thick copper metal leads on the substrate, which has great limitations in appl...

Claims

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Application Information

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IPC IPC(8): H01L27/12H01L27/15H01L21/77G09F9/33
CPCH01L27/124H01L27/1259H01L21/77H01L27/156G09F9/33H01L2021/775H01L25/167H01L25/0753G09G3/32H01L33/62H01L2933/0066G09G3/3406G09G2300/0426G09G2320/0204H01L33/005H01L33/382H01L2933/0016
Inventor 梁志伟曹占锋王珂刘英伟姚舜禹梁爽狄沐昕
Owner BOE TECH GRP CO LTD