Flip-chip light emitting diode and light emitting device

Abstract

The invention provides a flip-chip light emitting diode and a light emitting device. The flip-chip light emitting diode comprises an epitaxial layer and a first contact electrode and a second contact electrode located on the epitaxial layer, wherein the epitaxial layer comprises a first semiconductor layer, a light-emitting layer and a second semiconductor layer which are stacked in sequence, the first contact electrode is electrically connected to the first semiconductor layer, the second contact electrode is electrically connected to the second semiconductor layer and extends towards the first contact electrode, the second contact electrode comprises a connecting part, a first arc-shaped extension part, a first linear extension part, a second arc-shaped extension part and a second linear extension part, the two sides of the connecting part are connected with the first arc-shaped extension part and the second arc-shaped extension part respectively, the first linear extension part is connected to the end, away from the connecting part, of the first arc-shaped extension part, and the second linear extension part is connected to the end, away from the connecting part, of the second arc-shaped extension part. According to the invention, current can be diffused more uniformly, and an electrode at a thimble area is prevented from being punctured by a thimble.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a flip-chip light-emitting diode and a light-emitting device. Background technique [0002] Light Emitting Diode (English: Light Emitting Diode, referred to as: LED) is a semiconductor device that uses carrier recombination to release energy to form light. The LED chip has low power consumption, pure chromaticity, long life, small size, and fast response time. , energy saving and environmental protection and many other advantages, it is widely used in lighting, visible light communication and light-emitting display and other scenarios. LED chips can be divided into three types: positive structure, flip structure and vertical structure. Compared with the traditional front-mounted chip, the flip-chip LED chip structure is to invert the diode structure, emit light from the sapphire side, and the electrode side can be fixed on the substrate with better heat dissi...

AI Technical Summary

Problems solved by technology

However, there are still some defects in the existing flip-chip LED chip structure

Specifically, due to the particularity of the structure of the contact electrode, the existing technology cannot solve the problem that the thimble easily breaks the contact electrode located in the thimble area during package die bonding, resulting in chip abnormality. If the contact electrode bypasses the thimble area, the problem of uneven luminescence caused by the current change

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