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LED packaging method

A LED packaging and chip technology, applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of high LED packaging cost, slow heat dissipation of silica gel, etc., and achieve the effect of improving luminous brightness, thin overall thickness, and cost saving

Pending Publication Date: 2021-12-17
FUJIAN TIANDIAN OPTOELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] In order to solve the problems of high cost of LED packaging in the prior art and the slow heat dissipation of the existing packaging using silica gel, the present invention provides a LED packaging method, which includes the following steps,

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Embodiment Construction

[0034] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of the embodiments of the present invention, rather than all embodiments; the technical features designed in the different embodiments of the present invention described below can be combined as long as they do not constitute conflicts; based on the embodiments of the present invention, the present invention All other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0035] In the description of the present invention, it should be noted that all the terms (including technical terms and scientific terms) used in the presen...

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Abstract

The invention relates to the technical field of LED packaging, in particular to an LED packaging method which comprises the following steps of cleaning a carrier bracket, arranging a soldering flux on the carrier bracket, and fixing a chip on the soldering flux for eutectic bonding, enabling the soldering flux to be volatilized, and combining the chip with the carrier bracket, cleaning the material after eutectic bonding, sequentially adding an adhesive and a solid fluorescent film above the chip, and then baking the chip and the solid fluorescent film so as to thoroughly cure the chip and the solid fluorescent film, arranging reflective glue on the periphery of the chip and curing to cover blue light around the chip, and carrying out packaging treatment by using a sealant. The solid fluorescent film is used for packaging, the lighting effect of the light-emitting diode is improved, the solid fluorescent film is thin in overall thickness and high in heat dissipation efficiency, the problem of heat dissipation in packaging of a finished light-emitting diode product is solved, and the luminance and reliability of the light-emitting diode are further improved.

Description

technical field [0001] The invention relates to the technical field of LED packaging, in particular to an LED packaging method. Background technique [0002] As the fourth-generation lighting source, LED light source has significant advantages such as high luminous efficiency, fast response speed, long service life, no toxic gas, no radiation, impact resistance, and easy control compared with previous generations of lighting products. Its application range and The market share is increasing day by day. [0003] However, the existing packaging of light-emitting diodes is generally to package a layer of fluorescent glue or silica gel with fluorescent powder on the LED chip; and the resin and curing agent react to form fluorescent glue or fluorescent glue with fluorescent powder on the LED chip. Powdered silica gel is expensive, and its size cutting, utilization rate, and operability are low; and the existing fluorescent glue or silica gel with phosphor powder is relatively th...

Claims

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Application Information

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IPC IPC(8): H01L33/50H01L33/64H01L33/48
CPCH01L33/505H01L33/642H01L33/48H01L2933/0033H01L2933/0041
Inventor 李玉元王浩陈锦庆林紘洋翁念义万喜红李昇哲
Owner FUJIAN TIANDIAN OPTOELECTRONICS CO LTD
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